Principal / Senior Principal Scientist (Lead, 3D IC Package Integration), Adv Pkg, IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 140,000 - 190,000; Full time

Job summary

A*STAR – Agency for Science, Technology and Research is seeking a Principal/Senior Principal Scientist (Lead, 3D IC Package Integration) in Advanced Packaging. Lead the integration roadmap for wafer-level SiP solutions, driving heterogeneous integration via 3D stacking and photonic-electronic co-integration.

Build scalable micro-bump and hybrid bonding capabilities for next-gen HPC interconnects. The role demands a PhD with 10–15 years in semiconductor packaging, strong leadership, and a track

Qualifications

• PhD in Electronics, Electrical Engineering, Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or a related field.

Responsibilities

• Evaluate industry trends and define differentiated 3D packaging platform architectures.
• Define simple advanced packaging process integration flow with minimum steps and lowest cost.
• Identify tech gaps and set clear specs for process modules and accountability.

Skills

Leadership

Project management

People management

Strategic thinking

Data analysis

Education

PhD in Electronics / related field

Master's + 15 years in 2.5D/3D packaging

Job description

Job Role

Principal / Senior Principal Scientist (Lead, 3D IC Package Integration), Advanced Packaging

We are seeking a results-driven leader to spearhead platform technology integration within the Advanced Packaging Department, focusing on wafer-level system-in-package (SiP) solutions. The successful candidate will define and execute the medium- to long-term advanced packaging integration roadmap, enabling heterogeneous integration through 3D IC stacking and photonic-electronic co-integration. The role includes developing highly scaled micro-bump and hybrid bonding technologies to support next-generation networking, AI, and high-performance computing (HPC) interconnects.

Job Responsibilities

• Evaluate industry trends and define differentiated 3D packaging platform technology architectures to obtain competitive advantage.
• Define simplest advanced packaging process integration flow with minimum number of process steps to realise platform technology architectures at lowest cost.
• Identify technology gaps and weak links with clear specifications for process module and make process module accountable for timely delivery.
• Realize platform architectures by closely working with a team of designers, integrators, process module and fab.
• Engage industry customers from proof of concept to low volume prototyping/manufacturing.
• Act as a project leader for industry, consortium, and internal core capability projects.
• Act as an influencer in internal leadership and industry collaborations.
• Build, mentor, and retain a high-performing team to deliver impact.
• Foster a culture of agility, technical excellence, individual and team innovation, intra-/inter-department collaboration, and continuous improvement.
• Effectively manage research funding obtained through grant proposals, industry partnerships, and strategic collaborations.
• Able to manage resource allocation efficiently amid competing priorities.
• Establish clear goals, metrics, and milestones to evaluate progress on technology development initiatives.
• Ensure effective project management, documentation, and knowledge dissemination across multidisciplinary teams.

Job Requirements

• PhD in Electronics, Electrical Engineering, Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or a related field.
• 10 - 15 years of experience in semiconductor industry, with expertise in device fabrication, Cu backend integration and exposure to 2.5D/3D advanced packaging technologies and managing projects and teams.
• Applicants holding a master’s degree with a minimum of 15 years of relevant experience in 2.5D/3D package integration, semiconductor process integration, or related fields will also be considered.
• Experience in advanced packaging technologies, particularly 2.5D/3D heterogeneous integration using micro-bump interconnects, and wafer-to-wafer or chip-to-wafer hybrid bonding technologies, will be highly advantageous.
• Broad knowledge of multiple process technologies including lithography, etch, thin films deposition, electroplating, CMP, bonding.
• Strong understanding of considerations in process development cycle including early pathfinding and manufacturing scalability.
• Strong, hands-on people manager demonstrating excellent leadership, communication, and strategic thinking skills.
• Extensive experience working in a diverse, matrixed environment and collaborating across functions.
• Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.