Technical Program Manager

Silicon Box Inc; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Silicon Box Inc is seeking a Technical Program Manager in Singapore to lead customers' technical projects, focusing on wafer bumping, WLCSP, and fanout packaging. You will coordinate with sales and engineering to ensure successful engagements and roadmap execution.

With 5–7 years in semiconductor assembly, you will apply DOE, FMEA, and reliability principles while communicating requirements across cross-functional teams and customers.

Qualifications

• Min 5–7 years of relevant experience in back-end semiconductor assembly.
• Hands-on in wafer-level packaging, including wafer bumping, eWLB or fanout packaging.
• Knowledge of DOE, reliability requirements, material selection, FMEA and quality tools.
• Self-driven with strong problem-solving and organization for daily support and programs.
• Excellent communication and ability to present to small and large groups.
• Familiarity with SAP or ERP systems is a plus.

Responsibilities

• Works with sales managers and customer service in all technical aspects of the customers’ engagements.
• Provides technical support to sales team to gain market share and improve customer’s profitability status.
• Communicates new customer technology requirements to the internal teams. Communicates and manage all customer process and package roadmap strategies.
• Coordinates factory/customer technical projects and act as the point of contact for new quality/reliability programs.
• Implements change notices, resolves technical issues.
• Prepares and participate in audits and factory visits with customers.
• Other ad-hoc activities assigned by the management.

Skills

Wafer bumping

WLCSP

Fanout packaging

DOE

FMEA

Quality tools

SAP / ERP

Communication skills

Tools

ERP systems

Job description

The Technical Program Manager is responsible for overall management of customers’ technical projects and related matters.

Candidates with wafer bumping, WLCSP, or fanout packaging experience are encouraged to apply for this position.

Responsibilities

• Works with sales managers and customer service in all technical aspects of the customers’ engagements
• Provides technical support to sales team to gain market share and improve customer’s profitability status.
• Communicates new customer technology requirements to the internal teams. Communicates and manage all customer process and package roadmap strategies.
• Coordinates factory/customer technical projects and act as the point of contact for new quality/reliability programs.
• Implements change notices, resolves technical issues.
• Prepares and participate in audits and factory visits with customers.
• Other ad-hoc activities assigned by the management.

Requirements

• Min 5 - 7 years of relevant working experience in the assembly process of the back end of semiconductor production.
• Possess good knowledge and hands-on experience in assembly processes especially in wafer-level packaging like wafer bumping, eWLB or other wafer-level Fanout Packaging.
• Knowledge on DOE, reliability requirements, material selection, FMEA, Failure Analysis and other quality and statistical tools.
• Self-driven and has excellent problem resolution and organizational skills for daily customer support and managing on-going and future programs.
• Has initiative and demonstrate excellent follow-up on active programs with multiple customers.
• Able to communicate and present effectively in small and large groups.
• Able to work independently and as a team player with customers and cross-functional teams within the organization.
• Familiarity with SAP or other ERP systems is an added advantage.