Senior / Engineer - NPI

UNITED TEST AND ASSEMBLY CENTER LTD; Singapore; Vor Ort; SGD 70.000 - 95.000; Vollzeit

Zusammenfassung

UNITED TEST AND ASSEMBLY CENTER LTD is seeking a Project Manager with a background in electrical/electronic engineering to manage semiconductor manufacturing projects from kick-off through full production.

You will work with internal teams and customers to ensure on-time delivery, maintain documentation, review specifications, and drive process improvements, with emphasis on reliability and quality in NPI activities.

Qualifikationen

• Degree or diploma in Electrical/Electronics or related engineering field.
• Minimum 3 years of engineering experience in semiconductor manufacturing.
• PM certification preferred.
• Knowledge of bumping, assembly materials interaction with package workmanship and reliability.
• Knowledge of WLCSP bumping process of 2P2M; DOE/SPC/FMEA/JMP/APQP standards.
• Bumping process knowledge on lithography, sputter, etching, plating, descum and ball drop.

Aufgaben

• Lead and close projects from engagement to closure with cross-functional teams.
• Maintain documentation from Kick-off to full production.
• Review customer specs on materials, processes and assembly.
• Identify gaps and propose customer solutions.
• Plan detailed project timelines, track progress and resolve issues.
• Monitor customer indices and conduct regular performance reviews.
• Develop project management skills and adapt to changes.
• Drive productivity and cost reduction in process integration.
• Collaborate with TPM, Sales and customers on design wins and NPI activities.

Kenntnisse

Project management

Team coordination

Documentation

Ausbildung

Degree/Diploma in Electrical/Electronics or Engineering

Tools

DOE

FMEA

JMP

APQP

Jobbeschreibung

Responsibilities

• Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer
• Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production
• Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification
• Initiates team discussion/ review on customer document gaps/ discrepancies and recommend proposals to customer
• Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders
• Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance
• Develop and grow people project management skills, adopting on dynamic changes and crisis management
• Drive for productivity improvement and cost reduction in process integration
• Work with TPM/ Sales/ customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue

Requirements

• Degree/Diploma in Electrical/Electronics, Engineering or equivalent
• Minimum 3 years of Engineering experience in Semiconductor manufacturing industry
• Preferably with Project Management Certification
• Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred
• Knowledge on WLCSP bumping process of 2P2M; DOE/SPC/ FMEA /JMP/ APQP standard
• Bumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred