Principal Research Engineer - 2.5D Packaging & Interconnects

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

A leading research organization in Singapore is looking for a Principal/Senior Principal Research Engineer to lead platform technology integration in their Advanced Packaging department. The successful candidate will have 15 years of experience in the semiconductor industry and be responsible for defining process capability roadmaps and managing projects within a team. This role requires strong leadership and communication skills, along with a deep understanding of semiconductor technology. Competitive compensation is offered.

Qualifications

• 15 years of experience in the semiconductor industry.
• Expertise in Cu backend integration.
• Broad knowledge of process technologies including lithography, etch, and CMP.

Responsibilities

• Evaluate industry trends and define platform technology architectures.
• Manage research funding and ensure resource allocation.
• Build, mentor, and retain a high-performing team.

Skills

Leadership

Project management

Technical excellence

Communication

Strategic thinking

Education

Bachelor's degree in Electrical Engineering or related field

Job description

A leading research organization in Singapore is looking for a Principal/Senior Principal Research Engineer to lead platform technology integration in their Advanced Packaging department. The successful candidate will have 15 years of experience in the semiconductor industry and be responsible for defining process capability roadmaps and managing projects within a team. This role requires strong leadership and communication skills, along with a deep understanding of semiconductor technology. Competitive compensation is offered.