Principal Package Architect & Tech Leader

1100 Micron SemiAsiaOP Pte Ltd

Singapore

On-site

SGD 180,000 - 320,000

Full time

10 days ago

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Job summary

Micron Technology, Inc. in Singapore seeks an experienced packaging engineer to own architecture from feasibility through tape-out, qualification, and production readiness. You will act as the technical authority across product, silicon, technology, assembly, quality, supplier, and OSAT teams, balancing performance, manufacturability, cost, and schedule.

A Master’s degree and 10+ years’ experience are required, with Cadence Allegro / SiP tools and AI-enabled workflows.

Qualifications

Master’s degree in Electrical Engineering or related field.
Deep expertise in package architecture and silicon-package co-design.
Hands-on experience with multiple package technologies and manufacturability.
Proven ownership from feasibility to NPI tape-out and handoff.
Advanced proficiency with Cadence Allegro Package Designer / SiP Layout.

Responsibilities

Own package architecture from feasibility through tape-out and production readiness.
Serve as technical authority for complex package issues across cross-functional teams.
Balance performance, reliability, manufacturability, cost, and schedule.
Advance design rules, automation workflows, and technology roadmaps.
Represent packaging in silicon-package-board co-design and resolve trade-offs.