Senior AI Packaging Engineer

Micron; Singapore; On-site; SGD 120,000 - 170,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks an Advanced Packaging Integration Engineer to drive development and deployment of advanced packaging technologies for post-fab wafer finish and assembly.

You will collaborate with process, product, and reliability teams to optimize quality, yield, and cost, while ensuring smooth transfer to high-volume manufacturing. Strong data analytics and AI/tools experience preferred.

Qualifications

• PhD or MSc with ≥3 years, or Bachelor’s with ≥5 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.

Responsibilities

• Develop and enable advanced package technology for post-fab wafer finish and assembly processes.
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
• Integrate semiconductors while partnering with process and product engineering teams.
• Achieve and improve yields through data analysis and design/process changes; work with Probe, Yield Analysis, Test, and Product Engineering teams.
• Provide POR and MOR documentation for product transfer to production and ensure smooth transfer to high-volume manufacturing.

Skills

Analytical thinking

Problem solving

Leadership

Stakeholder management

Team collaboration

Education

PhD or MSc with ≥3 years

Tools

Python

R

SQL

Visual Basic

Job description

Micron Technology, Inc. in Singapore seeks an Advanced Packaging Integration Engineer to drive development and deployment of advanced packaging technologies for post-fab wafer finish and assembly.

You will collaborate with process, product, and reliability teams to optimize quality, yield, and cost, while ensuring smooth transfer to high-volume manufacturing. Strong data analytics and AI/tools experience preferred.