Senior Engineer, Advanced Packaging & AI Solutions

Micron Technology, Inc; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. is seeking a Senior Engineer in APTD CEM for Advanced Packaging Die Level Technology Engineering in Singapore.

The role focuses on developing and deploying wafer-level packaging, die stacking, and related processes to meet performance, cost, and reliability targets. You will work with multiple teams to transition new technologies from development to high-volume manufacturing, while ensuring quality and process documentation.

Qualifications

• PhD or Master’s degree with relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Strong knowledge of Python/SQL/R and data analytics for SPC/DOE.
• Experience with automation tools and equipment control is desirable.

Responsibilities

• Develop and optimize assembly processes for advanced packaging technologies.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Conduct data analysis to support advanced controls and yield improvements.
• Collaborate with cross-functional teams to integrate manufacturing processes.
• Provide POR/MOR documentation for product transfer to high-volume manufacturing.
• Apply AI-enabled tools to improve efficiency and quality.

Skills

Python

R

SQL

Analytical thinking

Communication

Leadership

Education

PhD or MSc in a relevant field

Bachelor's with 5+ years experience

Tools

Visual Basic for automation

Job description

Micron Technology, Inc. is seeking a Senior Engineer in APTD CEM for Advanced Packaging Die Level Technology Engineering in Singapore.

The role focuses on developing and deploying wafer-level packaging, die stacking, and related processes to meet performance, cost, and reliability targets. You will work with multiple teams to transition new technologies from development to high-volume manufacturing, while ensuring quality and process documentation.