Principal Advanced Packaging & Wafer-Level Engineer

Micron; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a highly qualified engineer with a PhD (or Master’s/Bachelor’s with experience) to lead wafer finishing process development for high‑performance memory packaging.

You will collaborate with Packaging Integration, Front End Wafer Fab, and Quality teams to meet performance, cost, manufacturability, and reliability targets. This role requires strong data analytics, proficiency in Python/R/SQL, and experience with process modeling and DOE.

Qualifications

• PhD with 2+ years’ semiconductor experience required in wafer bonding, plating, warpage control and packaging.
• Strong data analytics skills and programming for statistical analysis, modeling, and DOE.
• Experience with automation tools and equipment control is a plus.

Responsibilities

• Develop and enable deployment of wafer finishing processes to meet performance, cost, manufacturability, quality, reliability and schedule requirements.
• Coordinate with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality to integrate processes for optimal performance.
• Provide POR and MOR documentation for product transfer to high-volume manufacturing facilities.

Skills

Python

R

SQL

Visual Basic

E3

FDC

RMS

Data analytics

Process modeling

Statistical analysis

Education

PhD with 2+ years

Master's degree with 5+ years

Bachelor's degree with 7+ years

Job description

Micron Technology, Inc. in Singapore seeks a highly qualified engineer with a PhD (or Master’s/Bachelor’s with experience) to lead wafer finishing process development for high‑performance memory packaging.

You will collaborate with Packaging Integration, Front End Wafer Fab, and Quality teams to meet performance, cost, manufacturability, and reliability targets. This role requires strong data analytics, proficiency in Python/R/SQL, and experience with process modeling and DOE.