Staff Engineer, HBM Packaging & AI/ML Innovation

Micron; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a leader for the HIG HBM Package Product Engineering team.

You will guide a high-performing group to drive packaging and HBM product engineering activities, collaborating with Fab, Technology Development, and Design to meet Quality, Cost, Cycle Time and Scale objectives. You will own initiatives to improve ASM and Cube yields, resolve packaging issues, mentor teammates, and promote innovation across functions while enabling on-site work in

Qualifications

• Bachelor's or Master's in Electrical/Electronic/Mechanical Engineering.
• Strong problem-solving and root-cause analysis skills.
• Experience with statistics and data analysis tools.
• Willingness to work on-site in Singapore with international travel.
• Excellent communication and leadership abilities.

Responsibilities

• Improve ASM Yield and DPM in assembly manufacturing to reduce inline fallout.
• Improve HBM Cube yield through test optimization and coverage enhancements.
• Own cumulative yield and quality improvement initiatives across teams.
• Debug and resolve Qual and RMA packaging issues with cross-functional teams.
• Lead process conversions to boost yield, cost savings, and reliability.
• Mentor team members and foster growth within the organization.
• Collaborate with Fab, HBM Tech Development, Design, and QA teams.
• Promote innovation and drive project prioritization and execution.
• Advise on AI/ML models to enhance KPIs like Quality, Cost, Cycle Time.

Skills

Team leadership

Root cause analysis

Data analysis

Scripting

Communication skills

Education

Bachelor's/Master's in Electrical/Electronic/Mechanical Engineering

Tools

Circuit analysis tools

Data analysis scripting (Python/MATLAB)

Job description

Micron Technology, Inc. in Singapore is seeking a leader for the HIG HBM Package Product Engineering team.

You will guide a high-performing group to drive packaging and HBM product engineering activities, collaborating with Fab, Technology Development, and Design to meet Quality, Cost, Cycle Time and Scale objectives. You will own initiatives to improve ASM and Cube yields, resolve packaging issues, mentor teammates, and promote innovation across functions while enabling on-site work in