Senior Package Architect & AI-Driven Design Lead

Micron Technology; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a Senior Package Architect to lead end-to-end package architecture and silicon–package co-design for advanced memory solutions.

You will translate design intent into manufacturable, reliable, and scalable packaging, collaborating across product, silicon, technology, assembly, supplier, and OSAT teams. Requirements include a Master’s degree in engineering, 10+ years in package architecture, hands-on tool proficiency with Cadence Allegro, and a track

Qualifications

• Master's degree in Electrical, Mechanical, or Materials Engineering (PhD welcome).
• 10+ years in package architecture and silicon–package co-design.
• Hands-on with multiple package technologies and manufacturability.
• Ownership of complex package designs from feasibility to handoff.
• Proficiency with Cadence Allegro Package Designer / SiP Layout.
• Strong technical leadership and cross-functional collaboration.
• Ability to integrate AI-assisted tools into daily work.
• Influence roadmaps and standards across the org.

Responsibilities

• Own package architecture from feasibility to production readiness.
• Lead cross-functional reviews and risk mitigation.
• Advance design rules, methodologies, and roadmaps.
• Represent packaging in silicon–package–board co-design and resolve trade-offs.
• Apply AI literacy to research, analysis and problem solving.

Skills

Package architecture

Silicon–package co-design

Mentoring

Stakeholder communication

Leadership

AI literacy

Education

Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Engineering, or related discipline

PhD candidates welcomed

Tools

Cadence Allegro Package Designer / SiP Layout

Job description

Micron Technology, Inc. in Singapore seeks a Senior Package Architect to lead end-to-end package architecture and silicon–package co-design for advanced memory solutions.

You will translate design intent into manufacturable, reliable, and scalable packaging, collaborating across product, silicon, technology, assembly, supplier, and OSAT teams. Requirements include a Master’s degree in engineering, 10+ years in package architecture, hands-on tool proficiency with Cadence Allegro, and a track