Senior Engineer - Advanced Packaging & 3D Integration

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 180,000 - 240,000; Full time

Benefits offered by this job

Healthcare

Paid time off

Retirement savings plans

Paid parental leave

Professional development training

Job summary

Micron Technology Asia Operations in Singapore is seeking a Principal Engineer in the Advanced Package Technology Development team to drive innovation and collaboration. You will influence strategic decisions and help develop leading packaging solutions to strengthen Micron's technology leadership.

You will lead multi-disciplinary teams, mentor engineers, and work with DRAM manufacturing and OSAT partners to advance 2.5D/3D integration, hybrid bonding, and HBM initiatives, delivering high-value

Qualifications

• Over 5 years of professional experience in semiconductor advanced packaging.
• BS, MS, or Ph.D. in Materials Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field, or equivalent experience.
• Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding.
• Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process.
• Experience in DRAM manufacturing and OSAT companies.
• Understanding of DRAM wafer structure and process flows (Highly Preferred).
• A passion for innovation demonstrated by patent inventions or published literature!

Responsibilities

• Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value.
• Collaborate continuously with internal and external partners to ensure seamless technology integration.
• Consult and influence technical and strategic decisions at senior management levels.
• Lead multi-disciplinary technical teams and task forces to achieve strategic goals.
• Maintain effective communication with collaborators.
• Analyze and understand competitive trends to improve Micron's competitive edge.
• Participate actively in technology events, contributing to industry knowledge.
• Guide the development of packaging technology roadmaps.
• Assess competitive metrics through data intelligence for strategic advantage.
• Define requirements with proven technical data and content.
• Demonstrate profound technical expertise to develop new technologies and guide others.
• Build an extensive technical network across various domains.
• Troubleshoot advanced issues, providing mentorship for resolution.
• Innovate continuously through patents, trade secrets, technical presentations, and papers, leading to build wins and quality improvements.
• Engage in and promote ongoing cost reduction and quality improvement initiatives.

Education

Bachelor's/Master's/Ph.D. in Materials Science / Electrical / Chemical / Mechanical Engineering / Physics

Job description

Micron Technology Asia Operations in Singapore is seeking a Principal Engineer in the Advanced Package Technology Development team to drive innovation and collaboration. You will influence strategic decisions and help develop leading packaging solutions to strengthen Micron's technology leadership.

You will lead multi-disciplinary teams, mentor engineers, and work with DRAM manufacturing and OSAT partners to advance 2.5D/3D integration, hybrid bonding, and HBM initiatives, delivering high-value