Principal Engineer - Advanced Packaging & AI

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte. Ltd. seeks a highly skilled professional to develop and optimize assembly processes for advanced packaging technologies.

You will focus on wafer-level packaging, die stacking, and process control to meet performance, cost, manufacturability, and reliability targets. You will lead cross-functional teams across packaging engineering, front-end fab, and quality to ensure smooth technology transfer from development to high‑volume production, while

Qualifications

• PhD with ≥2 years, or Master's with ≥5 years, or Bachelor's with ≥7 years in a relevant field.
• Experience in semiconductor process development or equipment evaluation, preferably wafer bonding, die stacking and packaging.

Responsibilities

• Develop and optimize assembly processes for advanced packaging technologies.
• Improve product quality, yield, and productivity while controlling costs.
• Collaborate with internal and external teams to transfer technologies to production.

Skills

Analytical thinking

Leadership

Stakeholder management

Independent work

Cross-functional collaboration

Education

PhD in Electrical Engineering / Materials Science / Chemical Engineering / Physics

Master's degree in related field

Bachelor's degree with extensive relevant experience

Tools

Python

R

SQL

Visual Basic for Automation

E3

FDC (Fault Detection and Classification)

RMS (Recipe Management System)

Job description

Micron Semiconductor Asia Operations Pte. Ltd. seeks a highly skilled professional to develop and optimize assembly processes for advanced packaging technologies.

You will focus on wafer-level packaging, die stacking, and process control to meet performance, cost, manufacturability, and reliability targets. You will lead cross-functional teams across packaging engineering, front-end fab, and quality to ensure smooth technology transfer from development to high‑volume production, while