Principal Semiconductor Process Engineer AI-Driven Packaging

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore

On-site

SGD 120,000 - 180,000

Full time

2 days ago
Be an early applicant

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks a highly experienced process development scientist/engineer to advance wafer-level finishing processes for high-performance memory products.

You will lead development and deployment of post-fab processes, collaborating with Package Integration, Front End Wafer Fab, and Quality teams to ensure yield, reliability and cost targets. The role requires strong data analytics, proficiency in Python/R/SQL, and experience with automation tools.

Qualifications

  • PhD with ≥2 years, or Master’s with ≥5 years, or Bachelor’s with ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.

Responsibilities

  • Establish and improve wafer level process conditions and technologies (wafer thinning, backside metal interconnect).
  • Upgrade process capabilities and reduce production costs.
  • Establish and improve process management projects to deliver technology node requirements and scaling for next node.
  • Evaluate and promote new equipment and materials to enhance process capabilities.
  • Set up process parameters for a variety of semiconductor equipment.
  • Evaluate, promote, and plan for new equipment and materials.
  • Ensure defense coverage through process, measurement, inspection, and testing.
  • Establish correlations between defense mechanisms to identify improvement opportunities.
  • Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
  • Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives.
  • Work closely with teams to integrate manufacturing processes for optimal performance and quality control.
  • Ensure smooth transition from new product development, qualification, small volume production to high volume production.
  • Provide POR and MOR documentation for product transfer to production High Volume Manufacturing Fabrication facilities.
  • Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
  • Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

Skills

Python
R
SQL
Visual Basic
E3
FDC
RMS
DOE
SPC
Dashboarding
Data analytics
Process optimization

Education

PhD/MS/BS with relevant experience

Job description

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks a highly experienced process development scientist/engineer to advance wafer-level finishing processes for high-performance memory products.

You will lead development and deployment of post-fab processes, collaborating with Package Integration, Front End Wafer Fab, and Quality teams to ensure yield, reliability and cost targets. The role requires strong data analytics, proficiency in Python/R/SQL, and experience with automation tools.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Senior Process Engineer - AI-Driven Semiconductor Packaging
Senior Process Engineer - AI-Driven Semiconductor Packaging

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. • Singapore

On-site
SGD 120,000 - 180,000
Principal AI-Driven Semiconductor Packaging Engineer
Principal AI-Driven Semiconductor Packaging Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD • Singapore

On-site
SGD 120,000 - 190,000
Senior Engineer — AI-Driven Semiconductor Packaging
Senior Engineer — AI-Driven Semiconductor Packaging

Micron Technology, Inc • Singapore

On-site
SGD 120,000 - 190,000
Principal Engineer - Advanced Packaging & AI
Principal Engineer - Advanced Packaging & AI

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. • Singapore

On-site
SGD 180,000 - 260,000
Principal Engineer, Advanced Packaging & Wafer-Level Tech
Principal Engineer, Advanced Packaging & Wafer-Level Tech

Micron Technology, Inc. • Singapore

On-site
SGD 90,000 - 130,000
Senior Advanced Packaging & AI-Driven Integration Engineer
Senior Advanced Packaging & AI-Driven Integration Engineer

Micron Technology • Singapore

On-site
SGD 90,000 - 120,000
Staff/Principal: Advanced Packaging & Wafer-Level Tech
Staff/Principal: Advanced Packaging & Wafer-Level Tech

Micron Technology, Inc. • Singapore

On-site
SGD 120,000 - 180,000
Advanced Packaging Process Specialist — Drive AI Tech
Advanced Packaging Process Specialist — Drive AI Tech

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD • Singapore

On-site
SGD 60,000 - 90,000
Advanced Packaging Principal Engineer, AI-Enabled
Advanced Packaging Principal Engineer, AI-Enabled

Micron Technology, Inc. • Singapore

On-site
SGD 120,000 - 180,000
Senior Engineer, Advanced Packaging & AI-Driven Processes
Senior Engineer, Advanced Packaging & AI-Driven Processes

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. • Singapore

On-site
SGD 120,000 - 180,000