Senior Engineer, Advanced Packaging & AI-Driven Processes

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron’s Advanced Packaging Technology Development team is driving breakthrough AI-enabled advances in high-performance memory packaging. This role focuses on developing assembly processes for wafer-level packaging and die stacking to meet performance, cost, manufacturability, quality, reliability and schedule targets.

You will collaborate with multiple teams to deploy new technologies and integration flows, establish robust POR/MOR documentation, and promote new equipment and materials to

Qualifications

• PhD or Master’s in Electrical Engineering, Materials Science, Chemical Engineering, Physics or related field.
• Bachelor’s degree with 5+ years in semiconductor process development or equipment evaluation.

Responsibilities

• Develop and enable deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements.
• Collaborate with internal and external teams to coordinate development and launch of new technologies and integration flows.
• Develop and optimize wafer bonding, die stacking, and packaging processes with focus on yield, cost, and reliability.
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to high-volume manufacturing facilities.
• Integrate AI-enabled tools and insights to improve efficiency, quality, and problem solving in daily work.

Skills

Python

R

SQL

Visual Basic

E3

FDC

RMS

Statistics

DOE

Education

PhD or Master’s in Electrical Engineering / Materials Science / Chemical Engineering / Physics

Bachelor’s degree with 5+ years in relevant field

Tools

E3

FDC

RMS

Job description

Micron’s Advanced Packaging Technology Development team is driving breakthrough AI-enabled advances in high-performance memory packaging. This role focuses on developing assembly processes for wafer-level packaging and die stacking to meet performance, cost, manufacturability, quality, reliability and schedule targets.

You will collaborate with multiple teams to deploy new technologies and integration flows, establish robust POR/MOR documentation, and promote new equipment and materials to