Optical Interconnects R&D Scientist – Co-Packaged Optics

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

A leading research organization in Singapore is seeking an experienced engineer or physicist to develop advanced optical interconnects for Co-Packaged Optics. The ideal candidate will possess a Ph.D. or MS degree and have a strong background in optical interconnect modeling. Responsibilities include designing lenses for optical I/Os, evaluating fiber array assemblies, and proposing innovative ideas to enhance optical interconnects. Strong communication and teamwork skills are essential. Competitive compensation is offered.

Qualifications

• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber-to-chip coupling.
• Knowledge in wafer-level processes such as lithography and plasma etching.

Responsibilities

• Develop optical interconnects for Co-Packaged Optics platforms.
• Simulate impacts on optical signal transmission.
• Design lenses for optical I/Os in wafer-scale integration.

Skills

Optical interconnect modeling

Microscope-based alignment

Strong communication skills

Teamwork

Technical reporting

Education

MS or Ph.D in Engineering or Physics

Tools

Optical testing and metrology tools

Wafer bonding

Dicing

Job description

A leading research organization in Singapore is seeking an experienced engineer or physicist to develop advanced optical interconnects for Co-Packaged Optics. The ideal candidate will possess a Ph.D. or MS degree and have a strong background in optical interconnect modeling. Responsibilities include designing lenses for optical I/Os, evaluating fiber array assemblies, and proposing innovative ideas to enhance optical interconnects. Strong communication and teamwork skills are essential. Competitive compensation is offered.