HBM Packaging Engineer for NPI & AI-Driven Innovation

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Micron Technology is seeking Engineers to join the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor role focuses on advancing next‑generation memory and HBM packaging technologies and transitioning new products from development to high‑volume manufacturing.

The role requires a bachelor’s degree in engineering, strong analytical skills, and willingness to work shift and weekend coverage.

Qualifications

• Bachelor's degree in engineering or related field.
• Shift and weekend coverage is required.
• Strong analytical, logical, and critical thinking skills.

Responsibilities

• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.
• Apply engineering and statistical methods to accelerate learning cycles from DOE through product qualifications.
• Partner with AP Tech Development and manufacturing teams to support LVM and RAR.
• Perform FMEA risk assessments and implement corrective actions for abnormal conditions.
• Enable smooth technology transfer from development to high-volume manufacturing.

Skills

Analytical thinking

Effective communication

Team collaboration

AI literacy

Education

Bachelor's degree in Engineering

Tools

JMP

Python

Job description

Micron Technology is seeking Engineers to join the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor role focuses on advancing next‑generation memory and HBM packaging technologies and transitioning new products from development to high‑volume manufacturing.

The role requires a bachelor’s degree in engineering, strong analytical skills, and willingness to work shift and weekend coverage.