HBM & NPI Engineer — Memory Packaging Innovator

Micron Technology, Inc.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks an Engineer for High Bandwidth Memory (HBM) and New Product Introduction (NPI) to support next-generation memory packaging technologies.

The role focuses on transitioning developments into high-volume manufacturing with cross-functional collaboration across Development, Manufacturing and supplier teams. You will apply AI-enabled tools, perform DOE-driven analysis, and contribute to technology transfer initiatives while aligning with Micron’s core values

Qualifications

• PhD in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering or related discipline.
• Operations support including shift and weekend coverage is required.
• Strong analytical, logical, and critical thinking skills.
• Effective communicator, able to collaborate across all levels.
• Internship or experience in the semiconductor industry is a plus.
• Demonstrated leadership and a track record of impact is highly desirable.
• Interest in and knowledge of the semiconductor industry and Micron is preferred.

Responsibilities

• Integrate AI-enabled tool and insights into daily work to improve efficiency, quality, or effectiveness.
• Apply engineering and statistical methods to accelerate learning cycles from DOE through product qualifications.
• Partner with Advanced Package Technology Development and manufacturing teams to support LVM and RAR.
• Perform FMEA risk assessments and implement corrective actions for abnormal conditions.
• Enable smooth technology transfer from development to high-volume manufacturing.

Skills

Analytical thinking

Logical thinking

Critical thinking

Effective communicator

Education

PhD in Chemical Engineering

PhD in Materials Science

PhD in Electrical Engineering

PhD in Mechanical Engineering

Tools

MES systems

Automation

Data analytics (JMP)

Python

Job description

Micron Technology, Inc. in Singapore seeks an Engineer for High Bandwidth Memory (HBM) and New Product Introduction (NPI) to support next-generation memory packaging technologies.

The role focuses on transitioning developments into high-volume manufacturing with cross-functional collaboration across Development, Manufacturing and supplier teams. You will apply AI-enabled tools, perform DOE-driven analysis, and contribute to technology transfer initiatives while aligning with Micron’s core values