HBM Packaging Product Engineer: Yield & AI/ML (Singapore)

Micron; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

Micron Technology, a leader in memory and storage solutions, invites experienced engineers to join the HIG HBM Package Product Engineering team in Singapore. You will drive yield improvements, test optimization, and cross-functional collaboration to enhance quality and cost metrics while advancing AI/ML initiatives.

This role requires strong problem-solving skills, data analysis proficiency, and a track record in semiconductor packaging.

Qualifications

• Bachelors/Masters in Electrical/Electronic/Mechanical Engineering.
• 3+ years of experience in the semiconductor industry.
• Product Engineering and Packaging experience is preferred.
• Strong problem solving with root-cause understanding and solution space through in-depth circuit analysis.
• Good knowledge of statistics and data analysis tools and scripting.

Responsibilities

• Improve ASM Yield and DPM by enhancing assembly-related coverage in manufacturing flows.
• Improve HBM Cube yield through test optimization and coverage enhancements.
• Own cumulative yield improvements by leading cross-functional initiatives.
• Debug and address Qual and RMA Packaging issues via root-cause analysis and cross-functional collaboration.
• Lead Backend Process Conversions and High-Volume Manufacturing to boost yield, cost, and reliability.

Skills

Statistical analysis

Data scripting

Cross-functional collaboration

Problem solving

Education

Electrical/Electronic/Mechanical Engineering (Bachelors/Masters)

Tools

Test flow tooling

Advanced packaging tooling

Job description

Micron Technology, a leader in memory and storage solutions, invites experienced engineers to join the HIG HBM Package Product Engineering team in Singapore. You will drive yield improvements, test optimization, and cross-functional collaboration to enhance quality and cost metrics while advancing AI/ML initiatives.

This role requires strong problem-solving skills, data analysis proficiency, and a track record in semiconductor packaging.