Senior Manager, Package PE & System Engineering (HBM)

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 130,000 - 180,000; Full time

Job summary

Micron Technology, Inc. is seeking a Senior Manager for Package Process Engineering in Singapore. You will lead the Product and System Engineering for High Bandwidth Memory, coordinating with Fab, technology development, and design teams to deliver robust packaging solutions.

The role emphasizes leadership development, project management, and technical decision making to drive improvements across time zero coverage, yield, and quality in high‑volume manufacturing environments.

Qualifications

• Bachelors or Masters in Electrical/Electronic/Mechanical Engineering
• 12+ years in the semiconductor industry
• Experience in Product Engineering and Packaging preferred
• Strong leadership, problem solving, and cross-functional collaboration abilities

Responsibilities

• Improve test coverage for Time0 and package failure DPM; reduce inline fallout.
• Improve HBM yield via test optimization and coverage enhancements.
• Root cause analysis and resolution of quality, RMA packaging issues across cross-functional teams.
• Serve as subject matter expert and lead complex multi-disciplinary projects.
• Act as organization spokesperson and provide detailed project analysis.
• Develop future technical leaders through coaching and mentorship.

Skills

Leadership

Root cause analysis

Circuit analysis

Communication

Collaboration

Mentoring

Problem solving

Strategic thinking

Education

Electrical/Electronic/Mechanical Engineering

Job description

Micron Technology, Inc. is seeking a Senior Manager for Package Process Engineering in Singapore. You will lead the Product and System Engineering for High Bandwidth Memory, coordinating with Fab, technology development, and design teams to deliver robust packaging solutions.

The role emphasizes leadership development, project management, and technical decision making to drive improvements across time zero coverage, yield, and quality in high‑volume manufacturing environments.