Advanced Packaging Engineer - AI-Driven Memory Solutions

Micron Technology, Inc.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking Engineers for the Package Development Engineering Team for Advanced Packaging to support next‑generation memory and HBM packaging technologies, transitioning from development to high‑volume manufacturing.

You will collaborate with Development Team, Manufacturing and suppliers across Micron’s global network to enable smooth technology transfer and improve product quality through AI-enabled insights and rigorous DOE processes.

Qualifications

• Bachelor’s degree in Engineering or related field.
• Strong analytical and teamwork skills with a growth mindset.
• Willingness to support shift and weekend coverage.

Responsibilities

• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality or effectiveness.
• Contribute to continuous improvement by identifying, testing and sharing AI-enabled enhancements within one’s scope of work.
• Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments through product qualifications.
• Partner with Advanced Package Technology Development and manufacturing teams to support LVM and Run at Risk.
• Perform FMEA and implement control plans for abnormal conditions and enable smooth tech transfer to high‑volume manufacturing.

Skills

AI literacy

Analytical thinking

Collaboration

Leadership potential

Education

Bachelor's degree in Engineering

Tools

MES systems

Python

Data analytics tools

Job description

Micron Technology, Inc. in Singapore is seeking Engineers for the Package Development Engineering Team for Advanced Packaging to support next‑generation memory and HBM packaging technologies, transitioning from development to high‑volume manufacturing.

You will collaborate with Development Team, Manufacturing and suppliers across Micron’s global network to enable smooth technology transfer and improve product quality through AI-enabled insights and rigorous DOE processes.