HBM Product Engineer: Yield, AI-Enabled Innovation

Micron Technology; Singapore; On-site; SGD 70,000 - 120,000; Full time

Job summary

Micron Technology in Singapore is seeking a Product Engineer for the HIG HBM Packaging Product Engineering team. You will collaborate with Fab, Technology Development, and Packaging teams to improve yield, quality, and cost while driving process conversions and AI/ML-based KPI improvements.

The role requires 3+ years in semiconductors, strong problem-solving, and leadership capabilities, with on-site work in Singapore and travel to Taiwan, US, and Japan.

Qualifications

• 3 or more years of experience in the semiconductor industry.
• Product Engineering and Packaging Experience is preferred.
• Competent technical skills with root cause understanding.
• Good knowledge of statistics and data analysis tools and scripting.
• Experience in Test flow handling.
• Experience in Assembly Process and Advanced packaging is a plus.
• Excellent communication and presentation skills.
• Willingness to work on site in Singapore with international travel.

Responsibilities

• ASM Yield and DPM Improvement: improve assembly related coverage to boost yield.
• HBM Cube Yield Improvement: optimize yield via test coverage improvements.
• Cumulative Yield Ownership: lead cross-functional initiatives to enhance yield and quality.
• Root Cause and Resolution of Qual and RMA Packaging Issues with EFA/PFA.
• Backend Process Conversions and HVM: support robust process conversions to improve yield and cost.
• Cross-Functional Collaboration with Fab, HBM teams, and Quality/Reliability.
• Promotion of Innovation to maintain competitive edge.
• Project Management: develop skills for timely delivery of solutions.
• Technical Decision Making on risk and prioritization.
• AI/ML Advocate: collaborate to deploy models improving KPIs.

Skills

Problem solving

Statistical analysis

Communication skills

Leadership

Team collaboration

Education

Electrical/Electronic/Mechanical Engineering degree

Job description

Micron Technology in Singapore is seeking a Product Engineer for the HIG HBM Packaging Product Engineering team. You will collaborate with Fab, Technology Development, and Packaging teams to improve yield, quality, and cost while driving process conversions and AI/ML-based KPI improvements.

The role requires 3+ years in semiconductors, strong problem-solving, and leadership capabilities, with on-site work in Singapore and travel to Taiwan, US, and Japan.