AI-Enabled Packaging Engineer

Micron Technology; Singapore; On-site; SGD 60,000 - 100,000; Full time

Job summary

Micron Technology in Singapore is seeking engineers for the Package Development Engineering Team focused on Advanced Packaging. The role supports next-generation memory and HBM packaging, transitioning new products from development to high-volume manufacturing.

Responsibilities include integrating AI-based tools, DOE-driven learning, and collaboration with APDT and manufacturing to ensure smooth tech transfer and robust process control.

Qualifications

• Bachelor’s degree or higher in a relevant engineering field and related disciplines.
• Operations support, including shift and weekend coverage, is required.
• Strong analytical, logical, and critical thinking skills.
• Effective communicator with ability to collaborate across levels.
• Growth mindset and continuous learning emphasis.
• Semiconductor internship/experience is a plus; leadership is desirable.
• Interest in semiconductor industry and Micron is preferred.
• Applicant should apply AI literacy to research, analysis, and problem solving.

Responsibilities

• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.
• Contribute to continuous improvement by identifying, testing, and sharing AI-enabled enhancements within scope.
• Apply engineering and statistical methods to accelerate learning from DOE through product qualifications.
• Partner with Advanced Package Technology Development and manufacturing teams to support LVM and RAR.
• Perform FMEA and implement control plans and corrective actions for abnormal conditions.
• Enable smooth technology transfer from development to high-volume manufacturing.

Skills

Analytical thinking

Effective communication

Collaboration across levels

Growth mindset

AI literacy

Education

Bachelor’s degree or higher in Chemical Engineering

Electrical Engineering

Mechanical Engineering

Materials Science

Tools

JMP

Python

Job description

Micron Technology in Singapore is seeking engineers for the Package Development Engineering Team focused on Advanced Packaging. The role supports next-generation memory and HBM packaging, transitioning new products from development to high-volume manufacturing.

Responsibilities include integrating AI-based tools, DOE-driven learning, and collaboration with APDT and manufacturing to ensure smooth tech transfer and robust process control.