HBM Packaging Product Engineer — Yield & AI/ML

1100 Micron SemiAsiaOP Pte Ltd; Singapore; Sur place; SGD 120 000 - 190 000; Plein temps

Résumé du poste

Micron Technology, Inc. in Singapore seeks a Product Engineer within the HBM Systems and Product Engineering team to drive packaging and assembly yield improvements and collaborate across global teams on strategic and tactical goals.

The role requires a 3+ year semiconductor background, a degree in Electrical/Electronic/Mechanical engineering, and strong problem-solving, data analysis, and communication skills. Willingness to travel and work on-site in Singapore is expected.

Qualifications

• Bachelors/Masters in Electrical/Electronic/Mechanical Engineering.
• 3+ years in semiconductor industry.
• Product Engineering and Packaging experience preferred.
• Strong problem-solving with root cause analysis.
• Good statistics and data analysis skills; scripting.

Responsabilités

• ASM Yield and DPM Improvement: improve assembly related coverage to boost Time 0 and Field DPM and reduce inline fallout.
• HBM Cube Yield Improvement: enhance HBM Cube yield via test optimization and coverage with cross-functional collaboration.
• Cumulative Yield Ownership: lead initiatives to improve overall yield and quality for the organization.
• Root Cause and Resolution of Qual and RMA Packaging Issues: debug failures via EFA/PFA and drive improvements across teams.
• Backend Process Conversions and HVM: work with Fab, Technology Development, and Packaging teams to enable yield and cost improvements.
• Cross-Functional Collaboration: work with Fab, HBM TD, HBM Design, System Development, and Quality/Reliability teams to ensure successful product shipping.
• Promotion of Innovation: drive changes offering technical advantage over competitors.
• Project Management: develop management skills for timely delivery of solutions.
• Technical Decision Making: make final decisions on risk and project prioritization.
• AI/ML Advocate: collaborate to deploy models improving KPIs like Quality, Cost, Cycle Time and Scale.

Connaissances

Problem solving

Statistics

Data analysis

Communication skills

Leadership

Formation

Electrical/Electronic Engineering

Mechanical Engineering

Outils

Python scripting

Statistics tools

Description du poste

Micron Technology, Inc. in Singapore seeks a Product Engineer within the HBM Systems and Product Engineering team to drive packaging and assembly yield improvements and collaborate across global teams on strategic and tactical goals.

The role requires a 3+ year semiconductor background, a degree in Electrical/Electronic/Mechanical engineering, and strong problem-solving, data analysis, and communication skills. Willingness to travel and work on-site in Singapore is expected.