Senior HBM Packaging Engineer — Yield & AI (Singapore)

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a Senior Product Engineer (Pkg PE MFG) to drive package and HBM product engineering within the HBM Systems team.

You will lead cross-functional efforts to improve yield, reduce defects, and optimize test coverage while collaborating with Fab, TD, and QA to ship high‑quality end products. The role emphasizes data-driven problem solving, statistical analysis, and ML/AI knowledge to push KPIs like quality, cost, cycle time, and scale.

Qualifications

• Bachelor's/Master's in Electrical/Electronic/Mechanical Engineering with 5+ years in semiconductors.
• Strong problem-solving with root-cause analysis.
• Knowledge of statistics and data analysis; scripting.
• Experience in test flow handling and assembly/advanced packaging is a plus.
• Excellent communication and leadership skills.

Responsibilities

• Improve ASM yield and DPM across manufacturing flows.
• Lead cross-functional teams to boost cumulative yield.
• Diagnose EFA/PFA failures and drive improvements.
• Collaborate with Fab, TD, and QA teams on process changes.
• Promote AI/ML to enhance KPIs.

Skills

Yield optimization

Team collaboration

Statistical analysis

Scripting

Problem solving

ML familiarity

Education

Electrical/Electronic/Mechanical Eng

Job description

Micron Technology, Inc. in Singapore seeks a Senior Product Engineer (Pkg PE MFG) to drive package and HBM product engineering within the HBM Systems team.

You will lead cross-functional efforts to improve yield, reduce defects, and optimize test coverage while collaborating with Fab, TD, and QA to ship high‑quality end products. The role emphasizes data-driven problem solving, statistical analysis, and ML/AI knowledge to push KPIs like quality, cost, cycle time, and scale.