Engineer, Product & System Engineering, Heterogenous Integration

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 65,000 - 85,000; Full time

Job summary

A leading semiconductor company in Singapore seeks an experienced engineer for their High Bandwidth Memory Product & System Engineering team. This role involves optimizing test coverage, developing and validating next-generation HBM products, and collaborating with cross-functional teams. Candidates should have at least a Bachelor’s or Master’s degree in Electrical and Electronics Engineering, along with skills in problem-solving methodologies and data analysis. You’ll face exciting technical challenges while driving innovation and improving product efficiency.

Qualifications

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
• Coursework or internship experience in semiconductor devices, circuit design, or product validation is a plus.
• Solid understanding of problem-solving methodologies.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Exposure to data analysis, statistics, and scripting tools such as Python or JMP.

Responsibilities

• Ensure optimized test coverage on HBM design architectures.
• Develop, validate, and qualify Micron’s next-generation HBM products.
• Support design verification using CAD tools and Verilog simulations.
• Improve manufacturing test yields and resolve yield-related issues.
• Promote innovation for competitive advantage.
• Manage projects to ensure timely delivery of solutions.
• Make decisions on risk analysis and project prioritization.
• Collaborate with cross-functional teams for product development.

Skills

Problem-solving methodologies

Data analysis

CMOS technology

DRAM architecture

Scripting tools (Python, JMP)

Flexibility and eagerness to learn

Education

Bachelor’s or Master’s in Electrical and Electronics Engineering

Job description

As a key talent within High Bandwidth Memory (HBM) Product & System Engineering Media Health team, you will work together in a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will work within a team on a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities

• Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing.

• Product Development and Validation: This role is pivotal in developing, validating, characterizing, and qualifying Micron’s next-generation HBM products. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products.

• Support for New Product Design Validation: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies.

• Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets.

• Root Cause and Resolution: of Manufacturing Test Flow Issue, Qual and RMA Device Issues

• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.

• Coursework or internship experience in semiconductor devices, circuit design, or product validation is a plus.

• Solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.

• Familiarity with CMOS technology, DRAM architecture, and basic device physics.

• Exposure to data analysis, statistics, and scripting tools such as Python or JMP.

• Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.