Senior Advanced Packaging Application Engineer - TCB {hkhdv}

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. in Singapore seeks a Senior Advanced Packaging Application Engineer to lead thermo compression bonding initiatives in Woodlands/Sembawang.

You will translate customer roadmaps into equipment specifications and support technical sales through demonstrations. The role covers process development for TCB, Flip Chip, 2.5D/3D packaging, and power/thermal performance. You will collaborate with multidisciplinary teams, qualify machines, monitor yields, and contribute to

Qualifications

• Bachelor's or Master's in Engineering or related field.
• Minimum 5 years in semiconductor advanced packaging.
• Hands-on experience with TCB, NPI, process/qualification.

Responsibilities

• Understand customer packaging roadmaps and manufactur ing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving TCB, Flip Chip, 2.5D/3D packaging and related architectures.

Skills

Thermo Compression Bonding (TCB)

Advanced packaging

Chiplet Integration

CoWoS

CoPoS

2.5D Packaging

3D Packaging

Process Qualification

Equipment Qualification

Yield Improvement

Reliability Testing

Thermal Management

DOE

SPC

Failure Analysis

Machine Architecture

Semiconductor Packaging

Packaging Architecture

Education

Bachelor's or Master's in Materials/Mechanical/Electrical/Chemical/Semiconductor Eng

Tools

TCB equipment knowledge

Analytical equipment

Job description

Position Title

Senior Advanced Packaging Application Engineer (Thermo Compression Bonding - TCB)

Location

Woodlands/Sembawang

Working Days

5 Day A Week

Working Hours

9:00am - 6:00pm

Salary

SGD 8,000 - SGD 10,000/month (Based on experience and technical capability).

Responsibilities

• Customer Application Engineering
  Understand customer packaging roadmaps and manufacturing requirements.
  Translate process requirements into equipment specifications.
  Participate in customer technical discussions and application reviews.
  Support technical sales activities and customer demonstrations.
  Gather customer feedback and recommend future product enhancements.


• Advanced Packaging Process Development
  -Develop and support applications involving:
  Thermo Compression Bonding (TCB)
  Flip Chip Assembly
  Hybrid Bonding
  HBM Packaging
  CoWoS
  CoPoS
  2.5D Packaging
  3D Packaging
  Chiplet Integration
  Large Die Packaging
  -Evaluate and optimize:
  Bond force
  Temperature profiles
  Process windows
  Alignment accuracy
  Package warpage
  Yield
  Reliability


• Equipment Development
  -Work closely with multidisciplinary engineering teams to define:
  Machine architecture
  Functional specifications
  Accuracy requirements
  Throughput targets
  Thermal performance
  Bonding process capability
  Reliability requirements
  Customer acceptance criteria
  Provide technical guidance throughout equipment development.


• Machine Qualification
  Serve as the internal customer during equipment development.
  Responsibilities include:
  Defining machine acceptance criteria
  Process qualification
  FAT and SAT support
  Customer buyoff support
  Qualification reporting
  Continuous performance improvement


• Technology & Market Intelligence
  Monitor industry developments in:
  Advanced packaging technologies
  Semiconductor manufacturing trends
  Customer requirements
  Competitor equipment
  Emerging packaging architectures
  Support future product strategy and technology roadmap planning.

Requirements

• - Bachelor's or Master's Degree in:
  Materials Engineering
  Mechanical Engineering
  Electrical Engineering
  Chemical Engineering
  Physics
  Semiconductor Engineering
  Related Engineering disciplines


• -Minimum 5 years experience in semiconductor advanced packaging.


• -Hands-on experience in one or more of the following:
  Thermo Compression Bonding (TCB)
  Advanced Packaging Process Development
  Flip Chip Assembly
  New Product Introduction (NPI)
  Process Qualification
  Equipment Qualification
  Manufacturing Engineering
  Customer Process Development


• - Experience supporting advanced package technologies such as:
  HBM
  CoWoS
  CoPoS
  Chiplets
  2.5D Packaging
  3D Packaging
  Large Die Packaging


• - Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.


• - Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.


• - Strong understanding of:
  Thermo Compression Bonding (TCB)
  Semiconductor Packaging
  Flip Chip Assembly
  Process Qualification
  SPC
  DOE
  Yield Improvement
  Reliability Testing
  Failure Analysis
  Package Warpage
  Thermal Management
  Alignment Accuracy
  Semiconductor Manufacturing Processes


• - Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.