Wire Bond Process Engineer: Optimize Yield & NPI

Onsemi; Philippines; On-site; PHP 600,000 - 900,000; Full time

Job summary

onsemi is seeking a Wire Bond Process Engineer to optimize ultrasonic wire bonding for semiconductor production, focusing on yield, quality, and cost efficiency. You will lead DoE studies, resolve defects, and mentor junior staff while supporting NPI and equipment qualification.

The role requires a strong background in ultrasonic bonding, materials knowledge (Au, Cu, Al wires), and hands-on troubleshooting with diverse bonders. Collaboration with cross-functional teams is essential.

Qualifications

• Bachelor's or Master's degree in Mechanical, Electrical, Electronics, or Semiconductor Technology.
• 5+ years of experience in semiconductor backend manufacturing, wire bonding.
• Deep understanding of ultrasonic wire bonding, materials (Au/Cu/Al), and equipment; strong data analysis.

Responsibilities

• Define and document wire bonding recipes and parameters for new and existing products.
• Analyze yield trends, perform root-cause analyses, and drive corrective actions (PDCA) to improve Cp/Cpk and reduce DPMO.
• Coordinate setup, validation, and qualification of new wire bonding equipment and materials.
• Provide hands-on support to production teams and troubleshoot wire bonders (K&S, ASM, Shinkawa, Orthodyne).
• Create and update SOPs, FMEA, and control plans to meet ISO/IATF 16949 standards.
• Coach junior engineers and technicians on technical skills and best practices.

Skills

Problem-solving

Collaboration

Communication

Data analysis

Education

Bachelor's degree in Engineering

Master's degree in Engineering

Tools

K&S

ASM

Shinkawa

Orthodyne

Job description

onsemi is seeking a Wire Bond Process Engineer to optimize ultrasonic wire bonding for semiconductor production, focusing on yield, quality, and cost efficiency. You will lead DoE studies, resolve defects, and mentor junior staff while supporting NPI and equipment qualification.

The role requires a strong background in ultrasonic bonding, materials knowledge (Au, Cu, Al wires), and hands-on troubleshooting with diverse bonders. Collaboration with cross-functional teams is essential.