Wire Bond Engineer (Ultrasonic)

onsemi; Lapu-Lapu; On-site; PHP 500,000 - 900,000; Full time

Job summary

onsemi in the Philippines is seeking a dedicated Ultrasonic Wire Bond Process Engineer to own, characterize, and sustain ultrasonic wire bonding processes. You will drive process capability, define recipes, and monitor quality to deliver robust interconnects for diverse semiconductor packages.

The role requires hands-on semiconductor manufacturing experience with Al wire interconnects, DOE/ DMAIC, PFMEA, and collaboration with Production, Quality, and NPI teams to enable high yields and reliable

Qualifications

• Bachelor’s degree in Engineering or related field.
• At least 3 years in semiconductor manufacturing, with focus on wire bonding.
• Experience with Orthodyne, KnS Power Fusion or Shinkawa platforms.

Responsibilities

• Own and optimize ultrasonic wire bonding processes, including parameter definition, recipe control, SPC monitoring, and process capability.
• Drive yield and quality improvements by troubleshooting wire bond defects using 8D, DMAIC, and root cause analysis tools.
• Develop and maintain PFMEA, Control Plans, Work Instructions, OCAPs, and support GMRB documentation.
• Lead process characterization through DOE, window validation, and material/tooling optimizations.
• Manage bonding tools and consumables, including wedge selection, tooling life definition, and equipment capability for Orthodyne, K&S Power Fusion, and Shinkawa platforms.
• Support customer audits, IATF/ISO compliance, and change control activities.
• Collaborate with Production, Quality, Equipment, and NPI teams to support volume manufacturing, line transfers, and new product ramps.

Skills

Ultrasonic wire bonding

DOE

SPC

PFMEA

Root cause analysis

8D

Reliability testing

Statistical problem solving

Education

Bachelor’s degree in Engineering

Tools

Orthodyne

KnS Power Fusion

Shinkawa

Job description

The Ultrasonic Wire Bond Process Engineer owns, characterizes, and sustains ultrasonic wire bonding processes to deliver robust interconnect quality, high yields, and reliable semiconductor packages. This role requires strong semiconductor manufacturing experience across materials, tooling, equipment capability, and process optimization, supporting Al and Al‑based wire interconnects across diverse package families in a fast‑paced manufacturing environment.

Job Description

The Ultrasonic Wire Bond Process Engineer owns, characterizes, and sustains ultrasonic wire bonding processes to deliver robust interconnect quality, high yields, and reliable semiconductor packages. This role requires strong semiconductor manufacturing experience across materials, tooling, equipment capability, and process optimization, supporting Al and Al‑based wire interconnects across diverse package families in a fast‑paced manufacturing environment.

Basic Purpose of the Job

The Ultrasonic Wire Bond Process Engineer owns, characterizes, and sustains ultrasonic wire bonding processes to deliver robust interconnect quality, high yields, and reliable semiconductor packages. This role requires strong semiconductor manufacturing experience across materials, tooling, equipment capability, and process optimization, supporting Al and Al‑based wire interconnects across diverse package families in a fast‑paced manufacturing environment.

Reporting Relationship

Reports directly to the FOL Process Engineering Team Lead

Responsibilities

Major Duties and Responsibilities

• Own and optimize ultrasonic wire bonding processes, including parameter definition, recipe control, SPC monitoring, and process capability.
• Drive yield and quality improvements by troubleshooting wire bond defects (NSOP, broken/lifted wires, cratering, heel cracks, pad damage) using 8D, DMAIC, and root cause analysis tools.
• Develop and maintain PFMEA, Control Plans, Work Instructions, OCAPs, and support GMRB documentation.
• Lead process characterization through DOE, window validation, and material/tooling optimizations.
• Manage bonding tools and consumables, including wedge selection, tooling life definition, and equipment capability for Orthodyne, K&S Power Fusion, and Shinkawa platforms.
• Support customer audits, IATF/ISO compliance, and change control activities.
• Collaborate with Production, Quality, Equipment, and NPI teams to support volume manufacturing, line transfers, and new product ramps.

Qualifications

Job Specifications

• Education
• oBS Bachelor’s degree in Engineering (Mechanical, Industrial, Electronics, or related field).
• Experience
• oAt least 3 years in semiconductor manufacturing, with ≥2 years focused on wirebond ultrasonic wire bonding.
• oPractical experience on Orthodyne, KnS Power Fusion / platforms
• oExperience with Al wire or advanced interconnects is a plus.
• oExperience in thermosonic wire bonding is an advantage
• Skills and Knowledge Requirement
  • Strong understanding of:
  • Ultrasonic bonding fundamentals and mechanisms
  • IMC formation, bond strength, and bond durability
  • Pad metallization and bondability.
  • Proficient in DOE, SPC, MSA, PFMEA, and statistical problem solving
  • Familiar with wire bond‑related reliability risks and FA tools:
  • CSAM, X‑ray, SEM, bond pull/shear analysis
  • Strong written and verbal communication skills
  • Capable of leading technical escalations and customer‑facing discussions

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.