Wire Bond Engineer (Ultrasonic)

Onsemi; Hinoba-an; On-site; PHP 600,000 - 900,000; Part time

Job summary

onsemi is seeking an Ultrasonic Wire Bond Process Engineer in the Philippines. You will own and optimize ultrasonic wire bonding processes, drive yield improvements, and support audits in a fast-paced semiconductor environment.

The role requires a BS in Engineering and ≥3 years in semiconductor manufacturing, with ≥2 years in wire bonding. Collaboration with cross-functional teams and leadership of technical escalations are key. Onsemi offers challenging projects and growth opportunities.

Qualifications

• BS in Engineering (Mechanical, Industrial, Electronics, or related field) required.
• At least 3 years in semiconductor manufacturing, with ≥2 years focused on wirebond ultrasonic wire bonding.
• Experience with Orthodyne, KnS Power Fusion platforms, and Shinkawa platforms.
• Experience with Al wire or advanced interconnects is a plus.
• Thermosonic wire bonding experience is an advantage.
• Strong understanding of ultrasonic bonding fundamentals, bond strength, and bond durability.

Responsibilities

• Own and optimize ultrasonic wire bonding processes through parameter definition, recipe control, SPC monitoring, and process capability.
• Troubleshoot wire bond defects (NSOP, broken/lifted wires, cratering, heel cracks, pad damage) using 8D, DMAIC, and root cause analysis.
• Develop and maintain PFMEA, Control Plans, Work Instructions, OCAPs, and GMRB documentation.
• Lead process characterization through DOE, window validation, and material/tooling optimizations.
• Manage bonding tools and consumables, including wedge selection and equipment capability for Orthodyne, K&S Power Fusion, and Shinkawa platforms.
• Support customer audits, IATF/ISO compliance, and change control activities.
• Collaborate with Production, Quality, Equipment, and NPI teams for volume manufacturing and line transfers.

Skills

Ultrasonic bonding fundamentals

Bond strength and durability

Statistical problem solving (DOE, SPC,

Education

BS in Engineering (Mechanical, Industrial, Electronics, or related)

Tools

Orthodyne

KnS Power Fusion platforms

Shinkawa platforms

Job description

Job Description

I. Basic Purpose of the Job

The Ultrasonic Wire Bond Process Engineer owns, characterizes, and sustains ultrasonic wire bonding processes to deliver robust interconnect quality, high yields, and reliable semiconductor packages. This role requires strong semiconductor manufacturing experience across materials, tooling, equipment capability, and process optimization, supporting Al and Al‑based wire interconnects across diverse package families in a fast‑paced manufacturing environment.

II. Reporting Relationship

Reports directly to the FOL Process Engineering Team Lead

Responsibilities

III. Major Duties and Responsibilities

• Own and optimize ultrasonic wire bonding processes, including parameter definition, recipe control, SPC monitoring, and process capability.
• Drive yield and quality improvements by troubleshooting wire bond defects (NSOP, broken/lifted wires, cratering, heel cracks, pad damage) using 8D, DMAIC, and root cause analysis tools.
• Develop and maintain PFMEA, Control Plans, Work Instructions, OCAPs, and support GMRB documentation.
• Lead process characterization through DOE, window validation, and material/tooling optimizations.
• Manage bonding tools and consumables, including wedge selection, tooling life definition, and equipment capability for Orthodyne, K&S Power Fusion, and Shinkawa platforms.
• Support customer audits, IATF/ISO compliance, and change control activities.
• Collaborate with Production, Quality, Equipment, and NPI teams to support volume manufacturing, line transfers, and new product ramps.

Qualifications

IV. Job Specifications

• oBS Bachelor’s degree in Engineering (Mechanical, Industrial, Electronics, or related field).
• oAt least 3 years in semiconductor manufacturing, with ≥2 years focused on wirebond ultrasonic wire bonding.
• oPractical experience on Orthodyne, KnS Power Fusion / platforms
• oExperience with Al wire or advanced interconnects is a plus.
• oExperience in thermosonic wire bonding is an advantage

Skills and Knowledge Requirement

Strong understanding of:

• Ultrasonic bonding fundamentals and mechanisms
• IMC formation, bond strength, and bond durability
• Pad metallization and bondability.

Proficient in DOE, SPC, MSA, PFMEA, and statistical problem solving

Familiar with wire bond‑related reliability risks and FA tools:

• CSAM, X‑ray, SEM, bond pull/shear analysis

Strong written and verbal communication skills

Capable of leading technical escalations and customer‑facing discussions

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Job Info

• Job Identification 2505422
• Job Category Engineering, Manufacturing
• Posting Date 05/13/2026, 05:15 PM
• Degree Level Bachelors
• Job Schedule Part time
• Job Shift Day
• Locations 2nd Street, Block-C3, Lapu-Lapu City, 6015, PH

2nd Street, Block-C3, Lapu-Lapu City, 6015, PH