Process Engineering Wirebond

Careers; Lapu-Lapu; On-site; PHP 600,000 - 900,000; Full time

Job summary

onsemi is seeking a Wire Bond Process Engineer to optimize ultrasonic wire bonding processes in semiconductor manufacturing. You will manage NPI, perform DoE for process optimization, troubleshoot defects, and mentor junior staff to improve yield, quality, and cost-efficiency.

Candidates should have 5+ years in semiconductor backend manufacturing with deep knowledge of wire bonding techniques, materials (Au, Cu, Al), and data analytics such as Pareto and SPC.

Qualifications

• Bachelor’s or Master’s degree in Engineering and 5+ years in semiconductor backend.
• Experience in wire bonding and semiconductor backend manufacturing.
• Strong data analysis skills (Pareto, SPC).
• Ability to work cross-functionally and mentor staff.

Responsibilities

• Process Optimization & Development: Define, develop, and document wire bonding recipes and parameters for new and existing products.
• Yield & Quality Improvement: Analyze yield trends, implement root-cause analyses for failures, and drive corrective actions to improve Cpk/Cp and reduce DPMO.
• NPI & Qualification: Coordinate setup, validation, and qualification of new wire bonding equipment and materials.
• Troubleshooting & Support: Provide technical, hands-on support to production teams.
• Documentation & Compliance: Create and update SOPs, FMEA, and Control Plans to ISO/IATF 16949 standards.
• Mentorship: Coach junior engineers and technicians on technical skills.

Skills

Ultrasonic wire bonding

Wire bonding materials

Data analysis Pareto SPC

Problem solving

Collaboration

Communication

Education

Bachelor's or Master's degree in Engineering

Tools

K&S wire bonder

ASM wire bonder

Shinkawa wire bonder

Orthodyne platform

Job description

Wire Bond Process Engineer optimizes, sustains, and develops ultrasonic wire bonding processes to enhance yield, quality, and cost-efficiency in semiconductor manufacturing. Key duties include managing New Product Introductions (NPI), conducting DoE (Design of Experiments) for process optimization, troubleshooting defects (bond lifts, wire breaks), and mentoring junior staff.

onsemi(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

• Process Optimization & Development: Define, develop, and document wire bonding recipes and parameters (parameters, tools, materials) for new and existing products.
• Yield & Quality Improvement: Analyze yield trends, implement root-cause analyses for failures (e.g., bond lifts, cratering), and drive corrective actions (PDCA) to improve Cpk/Cp and reduce DPMO.
• NPI & Qualification: Coordinate the setup, validation, and qualification of new wire bonding equipment and materials, including material characterization.
• Troubleshooting & Support: Provide technical, hands-on support to production teams, including troubleshooting wire bonders (e.g., K&S, ASM, Shinkawa, Orthodyne platforms).
• Documentation & Compliance: Create and update process specifications, Standard Operating Procedures (SOPs), FMEA, and Control Plans to meet ISO/IATF 16949 standards.
• Mentorship: Coach junior engineers and technicians on technical skills and best practices.

Education: Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Electronics, or Semiconductor Technology).
Experience: Typically 5+ years of experience in semiconductor backend manufacturing, specifically in wire bonding.
Technical Skills: Deep understanding of ultrasonic wire bonding techniques, materials (Au, Cu, Al wires), and equipment, along with strong data analysis skills (e.g., Pareto analysis, SPC).
Soft Skills: Strong problem-solving, collaboration, and communication skills to work with cross-functional teams.