Ultrasonic Wire Bond Engineer: Yield & Quality Focus

Onsemi; Hinoba-an; On-site; PHP 600,000 - 900,000; Part time

Job summary

onsemi is seeking an Ultrasonic Wire Bond Process Engineer in the Philippines. You will own and optimize ultrasonic wire bonding processes, drive yield improvements, and support audits in a fast-paced semiconductor environment.

The role requires a BS in Engineering and ≥3 years in semiconductor manufacturing, with ≥2 years in wire bonding. Collaboration with cross-functional teams and leadership of technical escalations are key. Onsemi offers challenging projects and growth opportunities.

Qualifications

• BS in Engineering (Mechanical, Industrial, Electronics, or related field) required.
• At least 3 years in semiconductor manufacturing, with ≥2 years focused on wirebond ultrasonic wire bonding.
• Experience with Orthodyne, KnS Power Fusion platforms, and Shinkawa platforms.
• Experience with Al wire or advanced interconnects is a plus.
• Thermosonic wire bonding experience is an advantage.
• Strong understanding of ultrasonic bonding fundamentals, bond strength, and bond durability.

Responsibilities

• Own and optimize ultrasonic wire bonding processes through parameter definition, recipe control, SPC monitoring, and process capability.
• Troubleshoot wire bond defects (NSOP, broken/lifted wires, cratering, heel cracks, pad damage) using 8D, DMAIC, and root cause analysis.
• Develop and maintain PFMEA, Control Plans, Work Instructions, OCAPs, and GMRB documentation.
• Lead process characterization through DOE, window validation, and material/tooling optimizations.
• Manage bonding tools and consumables, including wedge selection and equipment capability for Orthodyne, K&S Power Fusion, and Shinkawa platforms.
• Support customer audits, IATF/ISO compliance, and change control activities.
• Collaborate with Production, Quality, Equipment, and NPI teams for volume manufacturing and line transfers.

Skills

Ultrasonic bonding fundamentals

Bond strength and durability

Statistical problem solving (DOE, SPC,

Education

BS in Engineering (Mechanical, Industrial, Electronics, or related)

Tools

Orthodyne

KnS Power Fusion platforms

Shinkawa platforms

Job description

onsemi is seeking an Ultrasonic Wire Bond Process Engineer in the Philippines. You will own and optimize ultrasonic wire bonding processes, drive yield improvements, and support audits in a fast-paced semiconductor environment.

The role requires a BS in Engineering and ≥3 years in semiconductor manufacturing, with ≥2 years in wire bonding. Collaboration with cross-functional teams and leadership of technical escalations are key. Onsemi offers challenging projects and growth opportunities.