Die-Bonding Process Engineer: Drive Yield & Reliability

Coherent Corp.

Calamba

On-site

PHP 900,000 - 1,500,000

Full time

9 days ago

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Job summary

Coherent Corp. Philippines is seeking a qualified engineer to optimize and sustain die-bonding processes for chip-on-carrier/submount products.

The role requires hands-on experience in die bonding, solder reflow, and process qualification, with a focus on yield, reliability, and production throughput. You will perform DOE, SPC, GR&R, and data analysis, lead root-cause investigations, and support NPI, equipment qualification, and cross-functional training.

Qualifications

Bachelor’s degree in Engineering or equivalent science fields.
3–5 years in semiconductor, laser, photonics or optoelectronics assembly manufacturing.
Hands-on experience in die bonding, solder reflow, process qualification, equipment validation; Lean Six Sigma is a plus.

Responsibilities

Optimize and sustain die-bonding processes for chip on carrier/submount products.
Establish process parameters and thermal profiles for alignment, solder quality, bond strength, and reliability.
Conduct DOE, process capability studies, SPC, GR&R, and data analysis to improve stability and yield.
Lead root-cause investigations and preventive/corrective actions for defects and variations.
Support equipment qualification, new product introduction, product transfer, and training.