Ultrasonic Wire Bond Process Engineer

onsemi; Lapu-Lapu; On-site; PHP 500,000 - 900,000; Full time

Job summary

onsemi in the Philippines is seeking a dedicated Ultrasonic Wire Bond Process Engineer to own, characterize, and sustain ultrasonic wire bonding processes. You will drive process capability, define recipes, and monitor quality to deliver robust interconnects for diverse semiconductor packages.

The role requires hands-on semiconductor manufacturing experience with Al wire interconnects, DOE/ DMAIC, PFMEA, and collaboration with Production, Quality, and NPI teams to enable high yields and reliable

Qualifications

• Bachelor’s degree in Engineering or related field.
• At least 3 years in semiconductor manufacturing, with focus on wire bonding.
• Experience with Orthodyne, KnS Power Fusion or Shinkawa platforms.

Responsibilities

• Own and optimize ultrasonic wire bonding processes, including parameter definition, recipe control, SPC monitoring, and process capability.
• Drive yield and quality improvements by troubleshooting wire bond defects using 8D, DMAIC, and root cause analysis tools.
• Develop and maintain PFMEA, Control Plans, Work Instructions, OCAPs, and support GMRB documentation.
• Lead process characterization through DOE, window validation, and material/tooling optimizations.
• Manage bonding tools and consumables, including wedge selection, tooling life definition, and equipment capability for Orthodyne, K&S Power Fusion, and Shinkawa platforms.
• Support customer audits, IATF/ISO compliance, and change control activities.
• Collaborate with Production, Quality, Equipment, and NPI teams to support volume manufacturing, line transfers, and new product ramps.

Skills

Ultrasonic wire bonding

DOE

SPC

PFMEA

Root cause analysis

8D

Reliability testing

Statistical problem solving

Education

Bachelor’s degree in Engineering

Tools

Orthodyne

KnS Power Fusion

Shinkawa

Job description

onsemi in the Philippines is seeking a dedicated Ultrasonic Wire Bond Process Engineer to own, characterize, and sustain ultrasonic wire bonding processes. You will drive process capability, define recipes, and monitor quality to deliver robust interconnects for diverse semiconductor packages.

The role requires hands-on semiconductor manufacturing experience with Al wire interconnects, DOE/ DMAIC, PFMEA, and collaboration with Production, Quality, and NPI teams to enable high yields and reliable