Process Engineering Wirebond

Onsemi; Philippines; On-site; PHP 600,000 - 900,000; Full time

Job summary

onsemi is seeking a Wire Bond Process Engineer to optimize ultrasonic wire bonding for semiconductor production, focusing on yield, quality, and cost efficiency. You will lead DoE studies, resolve defects, and mentor junior staff while supporting NPI and equipment qualification.

The role requires a strong background in ultrasonic bonding, materials knowledge (Au, Cu, Al wires), and hands-on troubleshooting with diverse bonders. Collaboration with cross-functional teams is essential.

Qualifications

• Bachelor's or Master's degree in Mechanical, Electrical, Electronics, or Semiconductor Technology.
• 5+ years of experience in semiconductor backend manufacturing, wire bonding.
• Deep understanding of ultrasonic wire bonding, materials (Au/Cu/Al), and equipment; strong data analysis.

Responsibilities

• Define and document wire bonding recipes and parameters for new and existing products.
• Analyze yield trends, perform root-cause analyses, and drive corrective actions (PDCA) to improve Cp/Cpk and reduce DPMO.
• Coordinate setup, validation, and qualification of new wire bonding equipment and materials.
• Provide hands-on support to production teams and troubleshoot wire bonders (K&S, ASM, Shinkawa, Orthodyne).
• Create and update SOPs, FMEA, and control plans to meet ISO/IATF 16949 standards.
• Coach junior engineers and technicians on technical skills and best practices.

Skills

Problem-solving

Collaboration

Communication

Data analysis

Education

Bachelor's degree in Engineering

Master's degree in Engineering

Tools

K&S

ASM

Shinkawa

Orthodyne

Job description

Job Description

Wire Bond Process Engineer optimizes, sustains, and develops ultrasonic wire bonding processes to enhance yield, quality, and cost-efficiency in semiconductor manufacturing. Key duties include managing New Product Introductions (NPI), conducting DoE (Design of Experiments) for process optimization, troubleshooting defects (bond lifts, wire breaks), and mentoring junior staff.

Responsibilities

• Process Optimization & Development: Define, develop, and document wire bonding recipes and parameters (parameters, tools, materials) for new and existing products.
• Yield & Quality Improvement: Analyze yield trends, implement root-cause analyses for failures (e.g., bond lifts, cratering), and drive corrective actions (PDCA) to improve Cpk/Cp and reduce DPMO.
• NPI & Qualification: Coordinate the setup, validation, and qualification of new wire bonding equipment and materials, including material characterization.
• Troubleshooting & Support: Provide technical, hands-on support to production teams, including troubleshooting wire bonders (e.g., K&S, ASM, Shinkawa, Orthodyne platforms).
• Documentation & Compliance: Create and update process specifications, Standard Operating Procedures (SOPs), FMEA, and Control Plans to meet ISO/IATF 16949 standards.
• Mentorship: Coach junior engineers and technicians on technical skills and best practices.

Qualifications

Education: Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Electronics, or Semiconductor Technology).
Experience: Typically 5+ years of experience in semiconductor backend manufacturing, specifically in wire bonding.
Technical Skills: Deep understanding of ultrasonic wire bonding techniques, materials (Au, Cu, Al wires), and equipment, along with strong data analysis skills (e.g., Pareto analysis, SPC).
Soft Skills: Strong problem-solving, collaboration, and communication skills to work with cross-functional teams.

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Job Info

• Job Identification 2504543
• Job Category Engineering, Manufacturing
• Posting Date 01/26/2026, 04:20 PM
• Degree Level Bachelors
• Locations 2nd Street, Block-C3, Lapu-Lapu City, 6015, PH

2nd Street, Block-C3, Lapu-Lapu City, 6015, PH