Die Bonding Process Engineer - Onsite, Yield & Quality

II-VI Incorporated; Calamba; On-site; PHP 360,000 - 720,000; Full time

Job summary

Coherent Corp. in the Philippines is seeking an experienced engineer to optimize and qualify die-bonding processes for chip-on-carrier assemblies. You will establish thermal profiles, perform DOE studies, and lead root-cause investigations to improve yield and reliability.

The role requires a bachelor’s in engineering and 3–5 years in semiconductor or related manufacturing, with hands-on die bonding and qualification experience. Onsite cleanroom work is required.

Qualifications

• Bachelor’s degree in Electronics, Electrical, Mechanical or Chemical Engineering or equivalent science courses.
• 3–5 years in semiconductor/laser/photonics/optoelectronics assembly manufacturing.
• Hands-on experience in die bonding, solder reflow, process qualification, equipment validation, yield improvement, and NPI; Lean Six Sigma is a plus.

Responsibilities

• Optimize, qualify, and sustain die-bonding processes for chip on carrier/submount products.
• Establish process parameters and thermal profiles for proper alignment, solder quality, bond strength, and reliability.
• Conduct DOE, process capability, SPC, GR&R, and data analysis to improve stability and productivity.
• Lead root-cause investigations and preventive/corrective actions for die-bonding defects and variations.
• Support equipment qualification, new product introduction, product transfer, ramp-up, documentation, and process training.

Skills

Die bonding / solder reflow

Process optimization

Thermal profiling

DOE / SPC / GR&R

Root-cause analysis

Documentation & project management

Education

Bachelor’s degree in Electronics / Electrical / Mechanical / Chemical Engineering

Tools

Microscopes

Profilometry

Interferometer

Electrical testing

Polishing / inspection tools

Job description

Coherent Corp. in the Philippines is seeking an experienced engineer to optimize and qualify die-bonding processes for chip-on-carrier assemblies. You will establish thermal profiles, perform DOE studies, and lead root-cause investigations to improve yield and reliability.

The role requires a bachelor’s in engineering and 3–5 years in semiconductor or related manufacturing, with hands-on die bonding and qualification experience. Onsite cleanroom work is required.