Wire Bond Process Engineer - NPI, DoE & Yield

Careers; Lapu-Lapu; On-site; PHP 600,000 - 900,000; Full time

Job summary

onsemi is seeking a Wire Bond Process Engineer to optimize ultrasonic wire bonding processes in semiconductor manufacturing. You will manage NPI, perform DoE for process optimization, troubleshoot defects, and mentor junior staff to improve yield, quality, and cost-efficiency.

Candidates should have 5+ years in semiconductor backend manufacturing with deep knowledge of wire bonding techniques, materials (Au, Cu, Al), and data analytics such as Pareto and SPC.

Qualifications

• Bachelor’s or Master’s degree in Engineering and 5+ years in semiconductor backend.
• Experience in wire bonding and semiconductor backend manufacturing.
• Strong data analysis skills (Pareto, SPC).
• Ability to work cross-functionally and mentor staff.

Responsibilities

• Process Optimization & Development: Define, develop, and document wire bonding recipes and parameters for new and existing products.
• Yield & Quality Improvement: Analyze yield trends, implement root-cause analyses for failures, and drive corrective actions to improve Cpk/Cp and reduce DPMO.
• NPI & Qualification: Coordinate setup, validation, and qualification of new wire bonding equipment and materials.
• Troubleshooting & Support: Provide technical, hands-on support to production teams.
• Documentation & Compliance: Create and update SOPs, FMEA, and Control Plans to ISO/IATF 16949 standards.
• Mentorship: Coach junior engineers and technicians on technical skills.

Skills

Ultrasonic wire bonding

Wire bonding materials

Data analysis Pareto SPC

Problem solving

Collaboration

Communication

Education

Bachelor's or Master's degree in Engineering

Tools

K&S wire bonder

ASM wire bonder

Shinkawa wire bonder

Orthodyne platform

Job description

onsemi is seeking a Wire Bond Process Engineer to optimize ultrasonic wire bonding processes in semiconductor manufacturing. You will manage NPI, perform DoE for process optimization, troubleshoot defects, and mentor junior staff to improve yield, quality, and cost-efficiency.

Candidates should have 5+ years in semiconductor backend manufacturing with deep knowledge of wire bonding techniques, materials (Au, Cu, Al), and data analytics such as Pareto and SPC.