Die Bonding Process Engineer – Yield & Reliability

Coherent Corp.; Calamba; On-site; PHP 600,000 - 900,000; Full time

Job summary

Coherent Corp. in the Philippines (Calamba, Laguna) is seeking a Process Engineer to develop, optimize, and deploy die bonding and wire bonding processes for high reliability.

You will establish die attach parameters and drive improvements in yield and cycle time across prototypes to production release. The role requires a bachelor’s degree in Electronics or Electrical Engineering with hands-on experience in semiconductor or optoelectronics manufacturing.

Qualifications

• Bachelor's degree in Electronics or Electrical Engineering or related field with relevant experience in Semiconductor or Electronics/Opto-electronics.

Responsibilities

• Develop, optimize, and deploy die bonding and wire bonding processes for high reliability.
• Establish process parameters for die attach for eutectic bonding and wire bonding apps.
• Improve yield, reliability, cycle time, and product performance via data-driven analysis.
• Support product development from prototype to production release.
• Provide day-to-day engineering support to production operations.
• Troubleshoot die placement accuracy, bond integrity, and wire pull strength issues.

Skills

Eutectic die bonding

Gold wire ball bonding

DOE

FMEA

SPC

Engineering drawings

Reliability standards

Education

Bachelor's degree in Electronics or Electrical Engineering

Tools

Die bonders

Wire bonders

Job description

Coherent Corp. in the Philippines (Calamba, Laguna) is seeking a Process Engineer to develop, optimize, and deploy die bonding and wire bonding processes for high reliability.

You will establish die attach parameters and drive improvements in yield and cycle time across prototypes to production release. The role requires a bachelor’s degree in Electronics or Electrical Engineering with hands-on experience in semiconductor or optoelectronics manufacturing.