Senior FOL Process Engineering Lead – Die Attach & Wire Bond

Onsemi; Legazpi; On-site; PHP 1,800,000 - 2,400,000; Full time

Job summary

onsemi in the Philippines is seeking a senior Process Engineering leader for FOL packaging. The role leads Die Attach, Wire Bond, Clip Attach, Plasma and AOI operations, ensuring stable yield and high process capability while aligning with customer and reliability requirements.

You will drive continuous improvement, lead cross‑functional teams, and ensure audit readiness across IATF/ISO. The ideal candidate has 8+ years in semiconductor assembly, strong analytical skills, and proven leadership

Qualifications

• Bachelor’s degree in Engineering (Mechanical, Electronics, Chemical, or related field).
• 8+ years in semiconductor assembly (Die Attach / Wire Bond), with leadership in high-mix, high-complexity FOL operations.
• Demonstrated capability in yield improvement, DOE, SPC, PFMEA/Control Plan, and equipment/materials qualification.
• Strong technical mastery in FOL processes (DA, WB, Clip Attach, Plasma) and failure mechanisms.
• Excellent analytical skills (Minitab/Exensio/SPC), problem-solving (8D, DMAIC), and audit/customer-facing communication.
• Ability to lead teams, manage cross-functional escalations, and sustain process governance under high-volume/high-complexity environments

Responsibilities

• Provide strategic process ownership for all FOL Package Group (SPC governance, PFMEA/Control Plan, recipe management, process capability Ppk, documentation).
• Lead engineering responses to yield losses, top defect contributors, customer complaints, reliability audit failures, and GMRB cases.
• Oversee execution of Continuous Improvement Plan, productivity projects, and proliferation activities across CBSM, SOSM, and PPD packages.
• Ensure audit readiness (IATF/ISO/Customer), compliance to change control, and cross-functional alignment with Production, Quality, Equipment, NPI, Planning, and SQE.
• Develop technical talent, strengthen process ownership, and balance engineering workload.

Education

Bachelor’s degree in Engineering (Mechanical, Electronics, Chemical, or related field)

Tools

Minitab

Exensio

SPC

Job description

onsemi in the Philippines is seeking a senior Process Engineering leader for FOL packaging. The role leads Die Attach, Wire Bond, Clip Attach, Plasma and AOI operations, ensuring stable yield and high process capability while aligning with customer and reliability requirements.

You will drive continuous improvement, lead cross‑functional teams, and ensure audit readiness across IATF/ISO. The ideal candidate has 8+ years in semiconductor assembly, strong analytical skills, and proven leadership