Wire Bond Process Engineer: Elevate Yields & Quality

Carsem (M) Sdn. Bhd

Ipoh

Presencial

MYR 70.000 - 100.000

Jornada completa

Hace 10 días
Generador de candidaturas

Una candidatura completa en un minuto — currículum y carta de presentación personalizados, listos para enviar.

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Ventajas ofrecidas por este puesto de trabajo

Medical education support
Dental parking
Medical for immediate family members
Car subsidy

Descripción de la vacante

Carsem (M) Sdn. Bhd in Ipoh, Malaysia is seeking a Wire Bond Process Engineer to develop and sustain processes for our semiconductor assembly operations, focusing on quality, efficiency and innovation.

You will train and supervise engineers, provide technical solutions to process issues, monitor yield and implement productivity and cost reduction programs. The role requires a Bachelor's degree in Engineering and at least 2 years' relevant experience; proficiency with JMP for DOE, Excel and

Formación

  • Bachelor’s Degree in Engineering or related field.

Responsabilidades

  • Train, motivate and supervise a team of engineers or process technicians or engineering operators to achieve process yields, quality and productivity through proper teamwork.
  • Provide technical support and solutions to process issues.
  • Develop and monitor yield, quality, and involve productivity improvement and cost reduction programs and also E/Q lots.
  • Develop new process and source for materials, equipment for continuous breakthrough improvement.
  • Review and ensure customer specification is complied.
  • Develop/improve process flow and update specifications to reflect changes in production by customers or in-house products.
  • Determine standard UPH, standard operation procedure and material for new equipment/process.
  • Quality accountability such as VOC/VOP/MRB/CAPA improvement and update specification to reflect control and customer audit failure

Conocimientos

JMP for DOE
Excel
PowerPoint

Educación

Bachelor's Degree in Engineering

Descripción del empleo

Carsem (M) Sdn. Bhd in Ipoh, Malaysia is seeking a Wire Bond Process Engineer to develop and sustain processes for our semiconductor assembly operations, focusing on quality, efficiency and innovation.

You will train and supervise engineers, provide technical solutions to process issues, monitor yield and implement productivity and cost reduction programs. The role requires a Bachelor's degree in Engineering and at least 2 years' relevant experience; proficiency with JMP for DOE, Excel and

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