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Mini-Circuits Technologies (Malaysia) Sdn Bhd is seeking a Process Development Engineer (Wire Bond) to sustain and optimize wire bond processes in production and NPI. You will drive process improvements, apply FMEA, and implement SPC to ensure quality and efficiency.
The role requires a Diploma or Bachelor’s degree with 2–3 years of wire bond experience and familiarity with related software such as AutoCad. Collaboration with equipment teams and mentoring of junior staff are key parts of the job.
Mini-Circuits Technologies (Malaysia) Sdn Bhd is seeking a Process Development Engineer (Wire Bond) to sustain and optimize wire bond processes in production and NPI. You will drive process improvements, apply FMEA, and implement SPC to ensure quality and efficiency.
The role requires a Diploma or Bachelor’s degree with 2–3 years of wire bond experience and familiarity with related software such as AutoCad. Collaboration with equipment teams and mentoring of junior staff are key parts of the job.