AI Wire Bond Engineer | Yield & Process Optimization

Carsem (M) Sdn. Bhd; Ipoh; Presencial; MYR 85.000 - 115.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Medical Education support

Dental Parking

Medical for immediate family members

car subsidy

Descripción de la vacante

Carsem (M) Sdn. Bhd is seeking an experienced Bonding Process Engineer in Ipoh to monitor bonding yield, identify root causes, and drive improvements across wedge and wire bonding processes.

You will lead DOE, FMEA, and 8D activities, develop robust process controls, and collaborate with Quality, Production, and Maintenance teams to ensure customer specifications are met and quality standards are sustained.

Formación

• Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, or related field).
• Experience in semiconductor assembly, specifically wedge bonding or wire bonding processes.
• Strong knowledge of statistical analysis and problem-solving tools (SPC, DOE, FMEA).
• Familiarity with bonding equipment and materials (Al wire, substrates, etc.).
• Good communication skills for customer interaction and reporting.

Responsabilidades

• Monitor and analyze bonding yield, identifying root causes of defects and yield loss.
• Lead yield improvement activities using structured problem-solving methodologies (8D, FMEA, DOE).
• Establish and maintain key process control parameters and ensure compliance in production.
• Drive continuous yield improvement to meet internal targets and customer expectations.
• Develop and optimize bonding recipes (force, ultrasonic power, time, temperature, etc.).
• Improve process stability and robustness against material and environmental variations.
• Conduct Design of Experiments (DOE) to validate process changes and improvements.
• Implement process standardization and best practices across production lines.
• Study and monitor bonding tool life performance and wear-out mechanisms.
• Define tool life criteria, replacement frequency, and optimization strategies.
• Collaborate with equipment and maintenance teams to ensure machine performance and uptime.
• Support equipment troubleshooting and qualification.
• Respond to customer inquiries, complaints, and technical requests in a timely manner.
• Perform failure analysis and provide clear, data-supported reports to customers.
• Participate in customer audits, technical reviews, and meetings as required.
• Ensure alignment of process capability with customer specifications and requirements.
• Maintain accurate process documentation, work instructions, and specifications.
• Prepare technical reports, yield analysis, and improvement updates.
• Ensure compliance with quality management systems and industry standards.
• Work closely with Quality, Production, Maintenance, and Engineering teams.
• Provide technical training and guidance to operators and technicians.
• Lead or participate in continuous improvement and cost-reduction initiatives. Ensure 5s implementation and enforcement.

Conocimientos

Wedge bonding

Wire bonding

Statistical analysis

FMEA

DOE

Customer communication

Educación

Bachelor's degree in Engineering

Herramientas

Bonding equipment

Descripción del empleo

Carsem (M) Sdn. Bhd is seeking an experienced Bonding Process Engineer in Ipoh to monitor bonding yield, identify root causes, and drive improvements across wedge and wire bonding processes.

You will lead DOE, FMEA, and 8D activities, develop robust process controls, and collaborate with Quality, Production, and Maintenance teams to ensure customer specifications are met and quality standards are sustained.