Wire Bond Process Development Senior Engineer — Hybrid

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Bayan Lepas; Hybrid; MYR 90,000 - 130,000; Full time

Job summary

OSRAM OS Penang is seeking a Process Development Senior Engineer (Wire Bond) to design and optimize wire bonding processes for mass production in Bayan Lepas, Malaysia. The role collaborates with operations on timing, roadmaps, and new product ramp-ups.

Candidate should have 2-5 years in DA & WB process engineering and development, plus hands-on skills in semiconductor or LED manufacturing processes, with knowledge of process development steps and statistics.

Qualifications

• Bachelor or Master degree in engineering or relevant field.
• 2-5 years in semiconductor DA & WB process engineering.
• 2-5 years in DA & WB process development.
• DA & WB process engineering knowledge & hands-on skillset in semiconductors or LED manufacturing processes.
• Knowledge in process development steps and statistics.

Responsibilities

• Develop WB process for mass production to handshake with operation team per project targeted timeline.
• Support and contribute in WB technology building block / roadmap.
• Support new product pre-series and ramp-up.
• Support post Q5 product quality, yield and FAR topics.

Skills

WB process development

Semiconductor DA & WB

Statistical process control

Process development knowledge

Education

Bachelor or Master degree in engineering

Job description

OSRAM OS Penang is seeking a Process Development Senior Engineer (Wire Bond) to design and optimize wire bonding processes for mass production in Bayan Lepas, Malaysia. The role collaborates with operations on timing, roadmaps, and new product ramp-ups.

Candidate should have 2-5 years in DA & WB process engineering and development, plus hands-on skills in semiconductor or LED manufacturing processes, with knowledge of process development steps and statistics.