Senior Copper Wire Bond Process Innovator

AccionLabs Sdn Bhd; Petaling Jaya; On-site; MYR 90,000 - 180,000; Full time

Job summary

AccionLabs Sdn Bhd in Malaysia seeks a Senior Wire Bond Process Development Engineer to lead development, optimization and release of wire bond processes for semiconductor packages. You will establish DOE-driven process windows, drive qualification, and collaborate with global assembly teams to enable ramp and manufacturing readiness.

The role emphasizes advancement of copper wire ball bonding, process characterization, and adoption of AI-enabled engineering methods, with exposure to patent

Qualifications

• Bachelor's degree in engineering or related discipline as listed.
• Minimum 5 years of semiconductor assembly experience with wire bond development.
• Hands-on experience with K&S wire bonding platforms.
• Strong knowledge of DOE, Six Sigma, SPC, and risk management.
• Experience with JMP or equivalent statistical software.

Responsibilities

• Lead development, optimization, qualification and release of wire bond processes for new products.
• Establish robust process windows via DOE, statistical analysis and characterization.
• Develop and optimize first/second bond and looping processes for advanced packaging.
• Characterize and qualify new wafer technologies, bond pads and substrates.
• Define process specs, limits and manufacturing control strategies.
• Evaluate and introduce new wire bonding technologies and equipment capabilities.
• Lead projects from concept through production release with cross-functional teams.
• Apply Six Sigma methodologies to process development and optimization.

Skills

Wire bond process development

DOE

Six Sigma

SPC

Statistical analysis

Root Cause Analysis

JMP

Project leadership

Education

Bachelor's Degree in Mechanical Engineering

Tools

K&S wire bonding platforms

Job description

AccionLabs Sdn Bhd in Malaysia seeks a Senior Wire Bond Process Development Engineer to lead development, optimization and release of wire bond processes for semiconductor packages. You will establish DOE-driven process windows, drive qualification, and collaborate with global assembly teams to enable ramp and manufacturing readiness.

The role emphasizes advancement of copper wire ball bonding, process characterization, and adoption of AI-enabled engineering methods, with exposure to patent