Senior Wire Bond Process Engineer

Osram (Malaysia) Sdn Bhd; Penang; On-site; MYR 120,000 - 180,000; Full time

Job summary

ams OSRAM in Penang, Malaysia is seeking a Process Development Senior Engineer (Wire Bond) to lead development of wire-bond processes for mass production and coordinate with operations to hit project timelines, ensuring robust, scalable processes.

You will contribute to WB technology building blocks and roadmaps, support pre-series and ramp-up of new products, and assist in post-Q5 quality, yield and FAR topics through data-driven problem solving.

Qualifications

• Bachelor or Master degree in engineering or relevant field.
• 2-5 years in semiconductor DA & WB process engineering.
• 2-5 years in DA & WB process development.
• DA & WB process engineering knowledge & hands on skillset in semiconductors or LED manufacturing processes.
• Knowledge in process development step and statistics.

Responsibilities

• Develop WB process for mass production to handshake with operation team per project targeted timeline.
• Support and contribute in WB technology building block / roadmap.
• Support new product pre-series and ramp-up.
• Support post Q5 product quality, yield and FAR topics.

Skills

DA & WB engineering

Process development

Statistics

Hands-on skills

Semiconductor/LED manufacturing

Education

Bachelor or Master degree in engineering

Job description

ams OSRAM in Penang, Malaysia is seeking a Process Development Senior Engineer (Wire Bond) to lead development of wire-bond processes for mass production and coordinate with operations to hit project timelines, ensuring robust, scalable processes.

You will contribute to WB technology building blocks and roadmaps, support pre-series and ramp-up of new products, and assist in post-Q5 quality, yield and FAR topics through data-driven problem solving.