Senior Die Attach/Wire Bond Equipment Engineer – Lead & Optimize

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 120,000 - 180,000; Full time

Benefits offered by this job

Medical

Education support

Dental

Parking

Car subsidy

Job summary

Carsem (M) Sdn. Bhd in Ipoh, Malaysia invites applications for a Senior Equipment Engineer Die Attach/Wire Bond to lead a technical team and drive equipment improvements across semiconductor manufacturing processes.

The role focuses on optimizing OEE, downtime, MTBA, MTBF, and MTTR, while managing new equipment integration and ensuring audit readiness. Strong leadership and data-driven problem solving are essential for success.

Qualifications

• Degree in Electrical & Electronics Engineering or Mechanical Engineering.
• Previous experience in semiconductor manufacturing and assembly preferred.

Responsibilities

• Lead a team of technicians in equipment maintenance, setup, troubleshooting and continuous improvement.
• Develop and implement plans to upgrade existing machines to improve OEE and product quality.
• Plan, organize and execute maintenance activities to keep equipment in peak condition.
• Collaborate with vendors and internal teams to resolve machine issues and boost performance.
• Oversee and report on OEE, downtime, MTBA, MTBF, MTTR metrics.
• Manage buy-off and setup of new equipment.
• Ensure audit readiness by following up on internal and external audits.
• Drive continuous improvement initiatives such as Poka-Yoke projects.
• Lead 5S Zone activities to improve workplace organization.

Skills

Team leadership

Data analysis

Statistical methods

Microsoft Excel

Problem-solving

Communication

Education

Electrical & Electronics Engineering or Mechanical Engineering

Tools

Microsoft Office

Job description

Carsem (M) Sdn. Bhd in Ipoh, Malaysia invites applications for a Senior Equipment Engineer Die Attach/Wire Bond to lead a technical team and drive equipment improvements across semiconductor manufacturing processes.

The role focuses on optimizing OEE, downtime, MTBA, MTBF, and MTTR, while managing new equipment integration and ensuring audit readiness. Strong leadership and data-driven problem solving are essential for success.