Senior Wire Bonding Engineer - Process Optimization
PCL INTERNATIONAL TECHNOLOGIES (PENANG) SDN. BHD.
Turn this role into an interview — a resume and cover letter built around what this employer wants.
Job summary
PCL International Technologies (Penang) Sdn. Bhd. is seeking a Senior Wire Bonding Engineer to drive advanced wire bonding activities within semiconductor assembly.
The role demands a minimum of 5 years’ experience with wire bonding, ball and wedge bonding, and solid knowledge of DOE, SPC and FMEA. You will collaborate with cross‑functional teams to optimize processes, improve yield and ensure quality. Responsibilities include process setup, qualification, validation, troubleshooting, reporting,
Qualifications
- Bachelor’s degree in an engineering discipline.
- Minimum 5 years in semiconductor assembly or wire bonding.
- Hands-on experience with ball and wedge bonding, process setup and troubleshooting.
- Knowledge of wire materials and process parameters.
- Experience with bond quality and reliability evaluations.
- Strong analytical and problem solving skills.
- Familiarity with DOE, SPC and FMEA.
- Ability to lead projects and communicate across teams.
Responsibilities
- Develop and optimize wire bonding processes and parameters for stability and yield.
- Perform setup, qualification, validation and optimization for new/existing processes.
- Troubleshoot issues such as non-stick defects, bond lift and loop problems.
- Conduct DOE and statistical analyses to define robust process windows.
- Prepare technical reports and present findings to management.
- Support audits and technical discussions related to wire bonding.
- Keep abreast of new wire bonding technologies and materials.
- Travel as required for supplier/customer support and projects.
Skills
Education
Job description
PCL International Technologies (Penang) Sdn. Bhd. is seeking a Senior Wire Bonding Engineer to drive advanced wire bonding activities within semiconductor assembly.
The role demands a minimum of 5 years’ experience with wire bonding, ball and wedge bonding, and solid knowledge of DOE, SPC and FMEA. You will collaborate with cross‑functional teams to optimize processes, improve yield and ensure quality. Responsibilities include process setup, qualification, validation, troubleshooting, reporting,
'/%3e%3cpath%20d='M101.744%2012.4726L102.894%2016.1947L99.0021%2013.2201L101.744%2012.4726ZM105.3%208.40937H100.488L99.0026%203.59473L97.5116%208.41047L92.7%208.40385L96.5965%2011.3834L95.1055%2016.1942L99.0021%2013.2196L101.408%2011.3834L105.3%208.40992V8.40937Z'%20fill='white'/%3e%3cdefs%3e%3clinearGradient%20id='paint0_linear_5593_1381'%20x1='90'%20y1='9.44471'%20x2='99'%20y2='9.44471'%20gradientUnits='userSpaceOnUse'%3e%3cstop%20stop-color='%2300AD70'/%3e%3cstop%20offset='0.998594'%20stop-color='%2300B67A'/%3e%3cstop%20offset='1'%20stop-color='%23DCDCE6'/%3e%3c/linearGradient%3e%3c/defs%3e%3c/svg%3e){kind=small}
