Wire Bond Process Engineer: Yield & SPC Optimization

Fairwork; Ipoh; On-site; MYR 55,800 - 89,280; Full time

Job summary

Fairwork is seeking a qualified candidate to enhance the Wire Bond Process in Ipoh, Malaysia. Responsibilities include improving assembly yield, analyzing data for manufacturing reports, and supporting engineering initiatives. The role requires a Bachelor’s degree in electronics or electrical engineering, along with experience in high-volume manufacturing.

Preferred candidates will have strong analytical skills and experience in process problem solving. Leadership experience is also an advantage.

Qualifications

• Bachelor's degree in electronics or electrical engineering.
• Experience in manufacturing environments preferred.
• Strong analytical skills with a hands-on approach.

Responsibilities

• Improve the Wire Bond Process and maintain assembly yield.
• Analyze data to create engineering reports for products.
• Support engineering initiatives for new equipment.

Skills

Electronics manufacturing knowledge

Process problem solving analysis

Analytical skills

Machine troubleshooting

Leadership

Education

Bachelor of Science/Engineering in electronics or electrical

Tools

SAS JMP

Minitab

SPC knowledge

Job description

Fairwork is seeking a qualified candidate to enhance the Wire Bond Process in Ipoh, Malaysia. Responsibilities include improving assembly yield, analyzing data for manufacturing reports, and supporting engineering initiatives. The role requires a Bachelor’s degree in electronics or electrical engineering, along with experience in high-volume manufacturing.

Preferred candidates will have strong analytical skills and experience in process problem solving. Leadership experience is also an advantage.