Senior Equipment Engineer - Semiconductor Manufacturing Lead

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 120,000 - 180,000; Full time

Benefits offered by this job

Medical

Education support

Dental

Parking

Medical for immediate family members

car subsidy

Job summary

Carsem (M) Sdn. Bhd., Ipoh, Malaysia, is seeking a Senior Equipment Engineer - FOL Die Attach/Wire Bond to lead a team of technicians and drive continuous improvement across semiconductor equipment.

The role focuses on elevating equipment performance, OEE, downtime, MTBA/MTBF/MTTR, and implementing projects to boost productivity and product quality. A degree in Electrical & Electronics or Mechanical Engineering is required.

Qualifications

• Degree in Electrical & Electronics Engineering or Mechanical Engineering.
• Experience in semiconductor manufacturing preferred.
• Strong leadership and mentoring abilities.

Responsibilities

• Supervise technicians on maintenance, setup, troubleshooting and improvement projects.
• Lead productivity upgrades and plan equipment upgrades to boost OEE and product quality.
• Manage maintenance planning and reliability initiatives.
• Collaborate with vendors and internal teams to resolve machine issues.
• Analyze performance metrics (OEE, downtime, MTBA/MTBF/MTTR) and report findings.
• Oversee new equipment buy-off and integration, and ensure audit readiness.

Skills

Leadership

Statistical analysis

Data analysis

Education

Degree in Electrical & Electronics Engineering or Mechanical Engineering

Tools

MS Office

Job description

Carsem (M) Sdn. Bhd., Ipoh, Malaysia, is seeking a Senior Equipment Engineer - FOL Die Attach/Wire Bond to lead a team of technicians and drive continuous improvement across semiconductor equipment.

The role focuses on elevating equipment performance, OEE, downtime, MTBA/MTBF/MTTR, and implementing projects to boost productivity and product quality. A degree in Electrical & Electronics or Mechanical Engineering is required.