Wire Bond & Die Attach Equipment Engineer (MES Lead)

Texas Instruments Incorporated; Kuala Lumpur; On-site; MYR 120,000 - 180,000; Full time

Job summary

Texas Instruments Incorporated seeks an Equipment Engineer to drive MES implementation for Wire Bond and Die Attach lines. The role begins with a 1-month TI orientation, then a 1–2 year MES project phase before transitioning to a production role to optimize uptime.

The position requires hands-on semiconductor equipment experience and strong collaboration across functions in a high-volume manufacturing setting.

Qualifications

• Minimum Bachelor’s degree in Electrical/EC/Mechanical/Materials or related field.
• Strong hands-on semiconductor equipment experience in Wire Bond and/or Die Attach (2+ years).

Responsibilities

• Lead MES implementation activities across project phase, defining workflows and qualification requirements.
• Translate shop-floor needs into digital process designs and data collection specs.
• Validate integrations and lead UAT and production deployment.
• Transition to production post-project to improve uptime and automation.

Skills

Verbal and written communication

Analytical thinking

Teamwork and collaboration

Initiative and drive for results

Time management

Education

Bachelor's degree in Electrical Engineering or related field

Tools

Siemens OpCenter

ASM equipment

KNS equipment

Job description

Texas Instruments Incorporated seeks an Equipment Engineer to drive MES implementation for Wire Bond and Die Attach lines. The role begins with a 1-month TI orientation, then a 1–2 year MES project phase before transitioning to a production role to optimize uptime.

The position requires hands-on semiconductor equipment experience and strong collaboration across functions in a high-volume manufacturing setting.