Wire Bond & Die Attach Equipment Engineer (MES Project)

Texas Instruments; Kuala Lumpur; On-site; MYR 120,000 - 180,000; Full time

Job summary

Texas Instruments is seeking an Equipment Engineer to lead MES implementation for wire bonding and die attach lines, with a 1‑month orientation and a 1–2 year project phase. You will transition to a production role to optimize uptime and automation in a high‑volume environment.

You’ll define workflows, data interlocks, and qualification requirements, then validate and deploy on the shop floor, collaborating with multiple functions. Strong communication and problem solving are essential.

Qualifications

• Bachelor's degree in a relevant engineering field
• Minimum 2 years hands-on semiconductor equipment experience in Wire Bond and/or Die Attach
• Strong communication and teamwork skills

Responsibilities

• Lead MES implementation and define equipment workflows and controls
• Translate shop-floor requirements into digital process designs and data collection needs
• Validate equipment integration scenarios and lead UAT on the production floor
• Transition to production to improve uptime and automate processes

Skills

Analytical thinking

Problem solving

Team collaboration

Time management

Communication skills

Education

Bachelor's degree in Electrical / Electrical & Computer / Chemical / Mechanical engineering

Tools

Siemens OpCenter MES

ASM equipment

KNS equipment

Job description

Job Description

Change the world. Love your job.

Join TI as a specialized Equipment Engineer to drive the digital transformation of our Wire Bond and Die Attach lines. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.

Key Responsibilities:

• MES Implementation (Project Phase): Represent equipment engineering in the MES rollout. Define equipment-specific workflows, setup/recipe controls, qualification requirements, and equipment states.
• Integration & Data: Translate physical shop-floor requirements into digital process designs. Define data collection needs and equipment interlocks to ensure seamless hardware-to-software communication.
• Validation: Validate equipment integration scenarios and lead User Acceptance Testing (UAT) and deployment on the production floor.
• Sustaining (Post-Project Phase): Transition to a production role to manage equipment reliability, troubleshoot MES-related equipment issues, and leverage your implementation knowledge to drive continuous improvement in automation and uptime.

Qualifications

• Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
• Strong hands‑on semiconductor equipment experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience

Preferred Qualifications

• Equipment experience with ASM and KNS
• Experience working withMES platforms, whether Siemens OpCenter or another comparable MES productmodeling or configuration
• Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and elevate early
• Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
• Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
• Strong verbal and written communication skills
• Demonstrated strong analytical, critical thinking and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Demonstrated ability to build strong, influential relationship

About Us

Why TI?

• Engineer your future. We empower our employees to truly open their career and development. ...
• We're different by design. ...
• Benefits that benefit you. ...

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn moreat TI.com .

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.

Texas Instruments is an equal opportunity employer.

TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.

Job Info

• Job Identification 25018263
• Job Category Manufacturing
• Posting Date 09/28/2026, 11:56 AM
• Apply Before 10/15/2026, 04:00 PM
• Degree Level Bachelor's Degree